1 |
M. W. Lee, M. Y. Lee, J. C. Choi, J. S. Park, and C. K. Song, Org. Electron., 11, 854 (2010). [DOI: https://doi.org/10.1016/j.orgel.2010.01.028]
DOI
|
2 |
J. S. Park, J. H. Park, and D. W. Lee, J. Micromech. Microeng., 28, 025004 (2018). [DOI: https://doi.org/10.1088/1361-6439/aa9f04]
DOI
|
3 |
A. Nakajima, J. Ceram. Soc. Jpn., 112, 533 (2004). [DOI: https://doi.org/10.2109/jcersj.112.533]
DOI
|
4 |
A. Nakajima, K. Abe, K. Hashimoto, and T. Watanabe, Thin Solid Films, 376, 140 (2000). [DOI: https://doi.org/10.1016/s0040-6090(00)01417-6]
DOI
|
5 |
X. Hou, F. Zhou, B. Yu, and W. Liu, Mater. Sci. Eng. A, 452, 732 (2007). [DOI: https://doi.org/10.1016/j.msea.2006.11.057]
DOI
|
6 |
H. J. Choi, S.V.N. Pammi, B. J. Park, J. H. Eom, H. An, H. Y. Kim, M. Kim, D. Seol, Y. Kim, and S. G. Yoon, J. Alloys Compd., 719, 271 (2017). [DOI: https://doi.org/10.1016/j.jallcom.2017.05.190]
DOI
|
7 |
M. Takeuchi, Phys. Status Solidi (a), 55, 653 (1979). [DOI: https://doi.org/10.1002/pssa.2210550237]
DOI
|
8 |
H. Hu, H. F. Ji, and Y. Sun, Phys. Chem. Chem. Phys., 15, 16557 (2013). [DOI: https://doi.org/10.1039/c3cp51848e]
DOI
|
9 |
W. A. Zisman, Contact Angle, Wettability, and Adhesion, 43, 1 (1964). [DOI: https://doi.org/10.1021/ba-1964-0043.ch001]
DOI
|
10 |
R. Forch, H. Schonherr, and A.T.A. Jenkins, Surface Design: Applications in Bioscience and Nanotechnology (Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, USA, 2009) p. 471.
|
11 |
X. Zhang, J. Qin, Y. Xue, P. Yu, B. Zhang, L. Wang, and R. Liu, Sci. Rep., 4, 4596 (2014). [DOI: https://doi.org/10.1038/srep04596]
DOI
|
12 |
X. Q. Meng, D. X. Zhao, J. Y. Zhang, D. Z. Shen, Y. M. Lu, L. Dong, Z. Y. Xiao, Y. C. Liu, and X. W. Fan, Chem. Phys. Lett., 413, 450 (2005). [DOI: https://doi.org/10.1016/j.cplett.2005.08.039]
DOI
|