1 |
K. Alzoubi, M. M. Hamasha, S. Lu, and B. Sammakia, J. Disp. Technol., 7, 593 (2011). [DOI: https://doi.org/10.1109/JDT.2011.2151830]
DOI
|
2 |
H. J. Moon, T. K. Gong, D. Kim, D. H. Choi, and D. I. Son, Trans. Electr. Electron. Mater., 17, 18 (2016). [DOI: http://doi.org/10.4313/TEEM.2016.17.1.18]
DOI
|
3 |
J. H. Kim, H. K. Lee, J. Y. Na, S. K. Kim, Y. Z. Yoo, and T. Y. Seong, Ceram. Int., 41, 8059 (2015). [DOI: https://doi.org/10.1016/j.ceramint.2015.03.002]
DOI
|
4 |
C. Guillen and J. Herrero, Thin Solid Films, 520, 1 (2011). [DOI: https://doi.org/10.1016/j.tsf.2011.06.091]
DOI
|
5 |
Z. M. Jarzebski and J. P. Morton, J. Electrochem. Soc., 123, 333C (1976). [DOI: https://doi.org./10.1149/1.2132647]
DOI
|
6 |
J. G. Kim, S. M. Yoon, and G. E. Jang, J. Ceram. Process. Res., 17, 80 (2016).
|
7 |
D. Chen, Sol. Energy Mater. Sol. Cells, 68, 313 (2001). [DOI: https://doi.org/10.1016/S0927-0248(00)00365-2]
DOI
|
8 |
C. H. Hong, J. H. Shin, B. K. Ju, K. H. Kim, N. M. Park, B. S. Kim, and W. S. Cheong, J. Nanosci. Nanotechnol., 13, 7756 (2013). [DOI: https://doi.org/10.1166/jnn.2013.7814]
DOI
|
9 |
A. L. Thangawng, R. S. Ruoff, M. A. Swartz, and M. R. Glucksberg, Biomed. Microdevices, 9, 587 (2007). [DOI: https://doi.org/10.1007/s10544-007-9070-6]
DOI
|
10 |
G. Haacke, J. Appl. Phys., 47, 4086 (1976). [DOI: https://doi.org/10.1063/1.323240]
DOI
|
11 |
S. M. Yoon, J. W. Choi, and G. E. Jang, J. Nanosci. Nanotechnol., 17, 7218 (2017). [DOI: https://doi.org/10.1166/jnn.2017.14753]
DOI
|
12 |
J. G. Kim and G. E. Jang, J. Ceram. Process. Res., 17, 103 (2016).
|