Browse > Article
http://dx.doi.org/10.4313/JKEM.2017.30.12.776

Optimization of Electrode Pattern for Multilayer Ceramic Heater by Finite Element Method  

Han, Yoonsoo (Engineering Ceramic Center, Korea Institute of Ceramic Engineering & Technology)
Kim, Shi Yeon (Engineering Ceramic Center, Korea Institute of Ceramic Engineering & Technology)
Yeo, Dong-Hun (Engineering Ceramic Center, Korea Institute of Ceramic Engineering & Technology)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.30, no.12, 2017 , pp. 776-781 More about this Journal
Abstract
In this study, we investigated the effect of electrode pattern design on the thermal shock resistance and temperature uniformity of a ceramic heater. A cordierite substrate with a low thermal expansion coefficient was fabricated by tape casting, and a tungsten electrode was printed and used as a heating element. The temperature distribution of the ceramic heater was calculated by a finite-element method (FEM) by considering various electrode patterns, and the tensile stress distribution due to the thermal stress was calculated. In the electrode pattern with a single-line width, the central part of the ceramic heater was heated to the maximum temperature, and the position of the ceramic heater having a double-line width was changed to the maximum temperature, depending on the position of the minimum line width pattern. The highest tensile stress was found along the edges of the ceramic heater. The temperature gradient at the edge determined the tensile stress intensity. The smallest tensile stress was observed for electrode pattern D, which was expected to be advantageous in resisting thermal shock failures in ceramic heaters.
Keywords
Multilayer ceramic heater; Finite element method; Electrode pattern; W paste;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 K. A. Peterson, K. D. Patel, C. K. Ho, S. B. Rohde, C. D. Nordquist, C. A. Walker, B. D. Wroblewski, and M. Okandan, Int. J. Appl. Ceram. Technol., 2, 345 (2005). [DOI: https://doi.org/10.1111/j.1744-7402.2005.02039.x]   DOI
2 H. Liu, Q. Qu, Q. Pan, Y. Wu, C. Huang, L. Li, M. Yu, and L. Guo, IEEE Trans. Appl. Supercond., 24, 7700204 (2014). [DOI: https://doi.org/10.1109/TASC.2013.2287278]
3 N. M. Alford, J. Breeze, X. Wang, S. J. Penn, S. Dalla, S. J. Webb, N. Ljepojevic, and X. Aupi, J. Eur. Ceram. Soc., 21, 2605 (2001). [DOI: https://doi.org/10.1016/S0955-2219(01)00324-7]   DOI
4 D. G. Cahill, Rev. Sci. Instrum., 73, 3701 (2002). [DOI: https://doi.org/10.1063/1.1141498]   DOI
5 T. Kojima, Y. Kuroki, and K. Yanagi, U.S. 5895591 A, 20 April, 1999.
6 G. A. Cogotsi, V. P. Zavada, and F. Ya. Kharitonov, Strength Mater., 16, 1651 (1984). [DOI: https://doi.org/10.1007/BF01537992]   DOI
7 X. Ding and J. J. Frye, U.S. 6929974 B2, 16 August, 2005.
8 W. K. Jones, Y. Liu, and M. Gao, IEEE Trans. Compon. Packag. Technol., 26, 110 (2003). [DOI: https://doi.org/10.1109/TCAPT.2003.811475]   DOI
9 B. Souhir, G. Sami, C. S. Hekmet, and K. Abdennaceur, Trans. Electr. Electron. Mater., 17, 189 (2016). [DOI: https://doi.org/10.4313/TEEM.2016.17.4.189]   DOI
10 G. A. Gogotsi, Ceramurgia Int., 6, 31 (1980). [DOI: https://doi.org/10.1016/0390-5519(80)90030-7]   DOI