1 |
C. H. Yang, S. C. Lee, T. C. Lin, and S. C. Chen, Thin Solid Films, 516, 1984 (2008). [DOI: https://doi.org/10.1016/j.tsf.2007.05.093]
DOI
|
2 |
E. Bertran, C. Corbella, M. Vives, A. Pinyol, C. Person, and I. Porqueras, Solid State Ionics, 165, 139 (2003). [DOI: https://doi.org/10.1016/j.ssi.2003.08.055]
DOI
|
3 |
H. K. Kim, Kor. J. Chem. Eng. NICE, 28, 4 (2010).
|
4 |
C. Guillen and J. Herrero, Thin Solid Films, 520, 1 (2011) . [DOI: https://doi.org/10.1016/j.tsf.2011.06.091]
DOI
|
5 |
Y. S. Park, H. K. Park, J. A. Jeong, H. K. Kim, K. H. Choi, S. I. Na, and D. Y. Kim, J. Electrochem. Soc., 156, H588 (2009). [DOI: https://doi.org/10.1149/1.3131362]
DOI
|
6 |
S. Elmas, S. Korkmaz, and S. Pat, Appl. Surf. Sci., 276, 641 (2013). [DOI: https://doi.org/10.1016/j.apsusc.2013.03.146]
DOI
|
7 |
H. C. Chae, C. H. Baeg, and J. W. Hong, Korean J. Met. Mater., 49, 192 (2011) . [DOI: https://doi.org/10.3365/kjmm.2011.49.2.192]
|
8 |
P. P. Edwards, A. Porch, M. O. Jones, D. V. Morgan, and R. M. Perks, Dalton Trans., 19, 2995 (2004). [DOI: https://doi.org/10.1039/B408864F]
|
9 |
J.C.C. Fan, F. J. Bachner, G. H. Foley, and P. M. Zavracky, Appl. Phys. Lett., 25, 693 (1974). [DOI: https://doi.org/10.1063/1.1655364]
DOI
|
10 |
Y. L. Choi and S. H. Kim, Korean J. Mater. Res., 16, 490 (2006). [DOI: https://doi.org/10.3740/MRSK.2006.16.8.490]
DOI
|
11 |
J. Y. Lee, J. W. Yang, J. H. Chae, J. H. Park, J. I. Choi, H. J. Park, and D Kim, Opt. Commun., 282, 2362 (2009). [DOI: https://doi.org/10.1016/j.optcom.2008.12.044]
DOI
|