Browse > Article
http://dx.doi.org/10.4313/JKEM.2017.30.11.693

A Study on Electricity Properties of Polyethylene Terephthalate Film due to Thermally Degradation  

Lee, Sung Ill (Department of safety Engineering, Korea National University of Transportation)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.30, no.11, 2017 , pp. 693-698 More about this Journal
Abstract
In this study, the thermal degradation properties of polyethylene terephthalate film has been examined by the capacitance, Tan ${\delta}$, thermography, FTIR, and SEM results at temperatures of $90{\sim}170^{\circ}C$ and frequencies of 0.3~3,000 kHz. It was found that the capacitance decreased with increasing thermal imaging temperature, probably caused by weakening of chemical bond with increasing temperature. Tan ${\delta}$ decreased upon increasing temperature from $90^{\circ}C$ to $170^{\circ}C$, probably due to the molecular motion of COOH radical or OH radical. The FT-IR measurement reveals that no structural change of the material occurs upon thermal radiation. The SEM measurement shows that the material is stabilized by thermal decomposition with increasing temperature; however, excessive thermal degradation obstructs the stabilization of the material.
Keywords
Thermal degradation; Capacitance; Thermal decomposition; Increasing temperature;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng. A, 445, 567 (2007). [DOI: https://doi.org/10.1016/j.msea. 2006.09.077]
2 Y. S. Cho, H. K. Lee, M. J. Shim, and S. W. Kim, Mater. Chem. Phys., 66, 70 (2000). [DOI: https://doi.org/10.1016/S0254-0584(00)00272-8]   DOI
3 J. J. Park, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 565 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.9.565]
4 J. Montesinos, R. S. Gorur, L. Zimmer, and N. F. Hubele, IEEE Trans. Dielectr. Electr. Insul., 7, 408 (2000). [DOI: https://doi.org/10.1109/94.848927]   DOI
5 S. Kumagal and N. Yoshimura, IEEE Trans. Dielectr. Electr. Insul., 7, 424 (2000). [DOI: https://doi.org/10.1109/94.848931]   DOI
6 D. R. Domingues and A. S. Pouzada, Key Eng. Mater., 230, 235 (2002). [DOI: https://doi.org/10.4028/www.scientific.net/KEM.230-232.235]
7 S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 15, 12 (2008). [DOI: https://doi.org/10.1109/T-DEI.2008.4446732]   DOI