Browse > Article
http://dx.doi.org/10.4313/JKEM.2016.29.6.327

Improving the Reliability by Straight Channel of As2Se3-based Resistive Random Access Memory  

Nam, Ki-Hyun (Department of Electronic Materials Engineering, Kwangwoon University)
Kim, Chung-Hyeok (Ingenium college of Liberal Arts, Kwangwoon University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.29, no.6, 2016 , pp. 327-331 More about this Journal
Abstract
Resistive random access memory (ReRAM) of metallic conduction channel mechanism is based on the electrochemical control of metal in solid electrolyte thin film. Amorphous chalcogenide materials have the solid electrolyte characteristic and optical reactivity at the same time. The optical reactivity has been used to improve the memory switching characteristics of the amorphous $As_2Se_3$-based ReRAM. This study focuses on the formation of holographic lattices patterns in the amorphous $As_2Se_3$ thin film for straight conductive channel. The optical parameters of amorphous $As_2Se_3$ thin film which is a refractive index and extinction coefficient was taken by n&k thin film analyzer. He-Cd laser (wavelength: 325 nm) was selected based on these basic optical parameters. The straighten conduction channel was formed by holographic lithography method using He-Cd laser.$ Ag^+$ ions that photo-diffused periodically by holographic lithography method will be the role of straight channel patterns. The fabricated ReRAM operated more less voltage and indicated better reliability.
Keywords
ReRAM; Holographic patterns; Straight channel;
Citations & Related Records
연도 인용수 순위
  • Reference
1 L. Chen, Y. Xu, Q. Q. Sun, P. Zhou, P. F. Wang, S. J. Ding, and D. W. Zhang, , 31, 1296 (2010).
2 J. Lee, E. M. Bourim, W. Lee, J. Park, M. Jo, S. Jung, J. Shin, and H. Hwang, Phys. Lett., 97, 172105 (2010). [DOI: http://dx.doi.org/10.1063/1.3491803]
3 Y. Watanabe, J. G. Bednorz, A. Bietsch, Ch. Gerber, D. Widmer, A. Beck, and S. J. Wind, Appl. Phys. Lett., 78, 3738 (2001). [DOI: http://dx.doi.org/10.1063/1.1377617]   DOI
4 S. Q. Liu, N. J. Wu, and A. Ignatiev, Appl. Phys. Lett., 76, 2749 (2000). [DOI: http://dx.doi.org/10.1063/1.126464]   DOI
5 S. Lai, IEDM Tech. Dig. (Washington, USA, 2003)
6 E. Garcia-Garcia, A. Mendoza-Galvan, Y. Vorobiev, E. Morales-Sanchez, J. Gonzalez-Hernandez, G. Martinez, and B. S. Chao, J. Vac. Sci. Technol., 17, 1805 (1999). [DOI: http://dx.doi.org/10.1116/1.581894]   DOI
7 J. I. Park, J. T. Lee, C. H. Yeo, Y. J. Lee, J. B. Kim, and H. B. Chung, Jpn. J. Appl. Phys., 42, 5090 (2003). [DOI: http://dx.doi.org/10.1143/JJAP.42.5090]   DOI
8 J. B. Yeo, S. D. Yun, T. W. Kim, and H. Y. Lee, J. Non-Crys. Solids, 354, 5343 (2008). [DOI: http://dx.doi.org/10.1016/j.jnoncrysol.2008.09.028]   DOI