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http://dx.doi.org/10.4313/JKEM.2016.29.12.824

Dry Etching Properties of PAR (poly-arylate) Substrate for Flexible Display Application  

Hwanga, Jin-Ho (Department of Electric Energy Systems, Incheon Campus of Korea Polytechnics)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.29, no.12, 2016 , pp. 824-828 More about this Journal
Abstract
In this study, effects of ICP (inductively coupled plasma) treatment on PAR thin film have been investigated. A maximum etch rate of the PAR thin films and the selectivity of PAR to PR were obtained as 110 nm/minand 1.1 in the $CF_4/O_2$ (5:15 sccm) gas mixture. We present the surface properties of PAR thin film with various treatment conditions. The surface morphology and cross section of the PAR thin film was observed by AFM (atomic force microscopy) and FE-SEM (filed emission scanning electron microscopy).
Keywords
PAR; ICP; AFM; Etching;
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1 K. Kim, Y. Zhao, H. Jang, S. Lee, J. Kim, K. Kim, J. H. Ahn, P. Kim, J. Y. Choi, and B. Hong, Nature, 457, 706 (2009). [DOI: https://doi.org/10.1038/nature07719]   DOI
2 R. Wang, X. Tao, Y. Wang, G. Wang, and S. Shang, Sur. Coat. Tech., 204, 1206 (2010). [DOI: https://doi.org/10.1016/j.surfcoat.2009.10.030]   DOI
3 H. P. Mahabaduge, W. I. Rance, J. M. Burst, M. O. reese, D. M. Meysing, C. A. Wolden, J. Li, and J. D. Beach, Appl. Phys. Lett., 106, 133510 (2015). [DOI: https://doi.org/10.1063/1.4916634]   DOI
4 S. Garner, S. Glaesernann, and X. Li, Appl. Phys. A, 116, 403 (2013). [DOI: https://doi.org/10.1007/s00339-014-8468-2]   DOI
5 S. H. Kim, S. W. Na, N. E. Lee, Y. W. Nam, and Y. H. Kim, Sur. Coat. Tech., 200, 2072 (2005). [DOI: https://doi.org/10.1016/j.surfcoat.2005.05.021]   DOI
6 K. Kalyanasundaram and M. Gratzel, Coord. Chem. Rev., 77, 347 (1998). [DOI: https://doi.org/10.1016/S0010-8545(98)00189-1]
7 H. U. Poll, U. Schladitz, and S. Schreiter, Surf. Coat. Technol., 489, 142 (2001).
8 N. D. Geyter, R. Morent, and C. Leys, Plasma Surces Sci. Technol., 78, 15 (2002).
9 M. A. Liberman and A. J. Lichtenberg, Principles of Plasma Discharges and Materials Processing (2nd ed.) (John Wiley & Sons, New Jersey, USA, 2005) p. 598. [DOI: https://doi.org/10.1002/0471724254]