1 |
T. W. Dakin, IEEE Transaction on Dielectrics and Electrical Insulation, EI-9, 121 (1974). [DOI: https://doi.org/10.1109/TEI.1974.299321]
DOI
|
2 |
J. Sato, O. Sakaguchi, N. Kubota, S. Makishima, S. Kinoshita, T. Shioiri, T. Yoshida, M. Miyagawa, M. Homma, and E. Kaneko, Proc. Transmission and Distribution Conference and Exhibition Asia Pacific (Yokohama, Japan, 2002) p.1791. [DOI: https://doi.org/10.1109/TDC. 2002.1177727]
DOI
|
3 |
T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Conf. Electr. Insul. Dielectr., 13, 319 (2006). [DOI: https://doi.org/10.1109/TDEI.2006.1624276]
DOI
|
4 |
T. Imai, F. Sawa, T. Yoshimitsu, T. Ozaki, and T. Shimizu, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 402 (2004).
|
5 |
J. J. Park, Trans. KIEE., 65 (2016).
|
6 |
T. Tanaka, M. Kozako, N. Fuse, and Y. Ohki, IEEE Transaction on Dielectrics and Electrical Insulation, 12, 669 (2005). [DOI: https://doi.org/10.1109/TDEI.2005.1511092]
DOI
|
7 |
G. Tsagaropoulos and A. Eisenberg, Macromolecules, 28, 6067 (1995). [DOI: https://doi.org/10.1021/ma00122a011]
DOI
|
8 |
Z. Farhadinejad, M. Ehsani, S. Moemenbellah, S.M.B. Alavi, M.M.S. Shirazi, and H. Borsi, IEEE Transactions on Nanotechnology, 11, 957 (2012). [DOI: https://doi.org/10.1109/TNANO.2012.2209458]
DOI
|
9 |
R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng. A, 445, 567 (2007). [DOI: https://doi.org/10.1016/j.msea.2006.09.077]
DOI
|
10 |
H. Shi, N. Gao, H. Jin, and C. Wang, Mater. Sci. Forum, 658, 463 (2010). [DOI: https://doi.org/10.4028/www.scientific.net/MSF.658.463]
DOI
|
11 |
A. Omrani, L. C. Simon, and A. A. Rostami, Mat. Chem. Phys., 114, 145 (2009). [DOI: https://doi.org/10.1016/j.matchemphys.2008.08.090]
DOI
|
12 |
Z. Ahmad, M. P. Ansell, and D. Smedley, Int. J. Eng. Technol., 10, 32 (2010).
|
13 |
S. A. Meguid and Y. Sun, Mater. Design, 25, 289 (2004). [DOI: https://doi.org/10.1016/j.matdes.2003.10.018]
DOI
|
14 |
R. R. Patel and N. Gupta, Proc. 15th Nat. Power Syst. Conf. (Mumbai, India, 2008) p. 361.
|
15 |
Q. Wang, G. Chen, and A. S. Alghamdi, Proc. 10th IEEE Int. Conf. Solid Dielectr. (Potsdam, Germany, 2010) p. 263.
|