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http://dx.doi.org/10.4313/JKEM.2016.29.12.796

Mechanical Properties of Epoxy Alumina Multi-Composites  

Park, Jae-Jun (Department of Electrical Elecrtonic Engineering, Joongbu University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.29, no.12, 2016 , pp. 796-802 More about this Journal
Abstract
In order to develop an electrical insulation material for gas GIS (insulation switch gear) spacer, 4 types of epoxy/micro-alumina (40, 50, 60, 70 wt%) composites and 9 types of epoxy/nano-alumina (1, 3, 5 g)/micro-alumina (40, 50, 60, 70 wt%) composites were prepared and tensile test was carried out. In here, nano-alumina was previously surface-treated with GDE (glycerol diglycidyl ether). As micro-alumina and GDE-treated nano-alumina contents increased, tensile strength increased and the highest value was shown in the system with 3 g GDE-treated nano-alumina.
Keywords
GIS spacer; Tensile strength; Epoxy/micro alumina composites; Epoxy/micro-nano alumina composites; Nano alumina surface modification;
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1 T. W. Dakin, IEEE Transaction on Dielectrics and Electrical Insulation, EI-9, 121 (1974). [DOI: https://doi.org/10.1109/TEI.1974.299321]   DOI
2 J. Sato, O. Sakaguchi, N. Kubota, S. Makishima, S. Kinoshita, T. Shioiri, T. Yoshida, M. Miyagawa, M. Homma, and E. Kaneko, Proc. Transmission and Distribution Conference and Exhibition Asia Pacific (Yokohama, Japan, 2002) p.1791. [DOI: https://doi.org/10.1109/TDC. 2002.1177727]   DOI
3 T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Conf. Electr. Insul. Dielectr., 13, 319 (2006). [DOI: https://doi.org/10.1109/TDEI.2006.1624276]   DOI
4 T. Imai, F. Sawa, T. Yoshimitsu, T. Ozaki, and T. Shimizu, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 402 (2004).
5 J. J. Park, Trans. KIEE., 65 (2016).
6 T. Tanaka, M. Kozako, N. Fuse, and Y. Ohki, IEEE Transaction on Dielectrics and Electrical Insulation, 12, 669 (2005). [DOI: https://doi.org/10.1109/TDEI.2005.1511092]   DOI
7 G. Tsagaropoulos and A. Eisenberg, Macromolecules, 28, 6067 (1995). [DOI: https://doi.org/10.1021/ma00122a011]   DOI
8 Z. Farhadinejad, M. Ehsani, S. Moemenbellah, S.M.B. Alavi, M.M.S. Shirazi, and H. Borsi, IEEE Transactions on Nanotechnology, 11, 957 (2012). [DOI: https://doi.org/10.1109/TNANO.2012.2209458]   DOI
9 R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng. A, 445, 567 (2007). [DOI: https://doi.org/10.1016/j.msea.2006.09.077]   DOI
10 H. Shi, N. Gao, H. Jin, and C. Wang, Mater. Sci. Forum, 658, 463 (2010). [DOI: https://doi.org/10.4028/www.scientific.net/MSF.658.463]   DOI
11 A. Omrani, L. C. Simon, and A. A. Rostami, Mat. Chem. Phys., 114, 145 (2009). [DOI: https://doi.org/10.1016/j.matchemphys.2008.08.090]   DOI
12 Z. Ahmad, M. P. Ansell, and D. Smedley, Int. J. Eng. Technol., 10, 32 (2010).
13 S. A. Meguid and Y. Sun, Mater. Design, 25, 289 (2004). [DOI: https://doi.org/10.1016/j.matdes.2003.10.018]   DOI
14 R. R. Patel and N. Gupta, Proc. 15th Nat. Power Syst. Conf. (Mumbai, India, 2008) p. 361.
15 Q. Wang, G. Chen, and A. S. Alghamdi, Proc. 10th IEEE Int. Conf. Solid Dielectr. (Potsdam, Germany, 2010) p. 263.