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http://dx.doi.org/10.4313/JKEM.2016.29.10.641

Insulation Life Estimation for Magnet Wire Under Inverter Surge and Temperature Stress  

Park, Jae-Jun (Department of Electrical Electronic Engineering, Joongbu University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.29, no.10, 2016 , pp. 641-646 More about this Journal
Abstract
Coil specimen was prepared by coating a copper wire with two varnish thin layers: the first was polyamideimide (PAI)/nanosilica (5 wt%) varnish and the second was anti-corona PAI/nanosilica (15 wt%) varnish. Insulation breakdown voltage was investigated under inverter surge condition at $20^{\circ}C$, $70^{\circ}C$, $100^{\circ}C$, $150^{\circ}C$, $200^{\circ}C$, $250^{\circ}C$, respectively. The insulation lifetime of the two layered coil was tens of times longer than that of original PAI coil. And the insulation lifetime decreased with increasing ambient temperature because there was weak binding strength between copper and varnish layer.
Keywords
Inverter surge; Insulation life estimation; Insulation life; Enamelled magnet wire; Double layer insulation coated;
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1 H. Okubo, N. Hayakawa, and G. C. Montanari, IEEE TRNS. DIELECTR. ELECTR. INSUL., 14, 6, 1516-1530 (2007). [DOI: http://dx.doi.org/10.1109/TDEI.2007.4401236]   DOI
2 H. Kikuchi and H. Hanawa, IEEE TRNS. DIELECTR. ELECTR. INSUL., 19, 1, 99-106 (2012). [DOI: http://dx.doi.org/10.1109/TDEI.2012.6148507]   DOI
3 Y. Kikuchi. T. Murata, Y. Uozumi, N. Fukumoto, M. Nagata, Y. Wakimoto, and T. Yoshimitsu, IEEE TRNS. DIELECTR. ELECTR. INSUL., 15, 6, 1617-1625 (2008). [DOI: http://dx.doi.org/10.1109/TDEI.2008.4712665]   DOI
4 E. Ildstad and S. R. Chalise, Proc. IEEE Conf. (2009) p. 85-88. [DOI: http://dx.doi.org/10.1109/ceidp.2009.5377720]
5 G. C. Stone, I. Culbert, E. A. Boulter, and H. Dhirani, IEEE Press Series on Power Engineering (2004).
6 E. Sugimoto, IEEE Electrical Insulation Magazine, 5, 1, 15-23, 1989. [DOI: http://dx.doi.org/10.1109/57.16949]   DOI
7 Indian Standard Winding Wires-Test Methods Part 5 Electrical Properties (First Revision) ICS 29.060.10 (2012).
8 J. J. Park, Y. B. Park, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 93 (2011). [DOI: http://dx.doi.org/10.4313/TEEM.2011.12.3.93]   DOI
9 Y. Kikuchi, T. Murata, Y. Uozumi, N. Fukumoto, M. Nagata, Y. Wakimoto, and T. Yoshimitsu, IEEE TRNS. DIELECTR. ELECTR. INSUL., 15, 6, 1617-1625 (2008) [DOI: http://dx.doi.org/10.1109/TDEI.2008.4712665]   DOI
10 H. Kikuchi and H. Hanawa, IEEE TRNS. DIELECTR. ELECTR. INSUL., 19, 1, 99-106 (2012). [DOI: http://dx.doi.org/10.1109/TDEI.2012.6148507]   DOI
11 M. Q. Nguyen, D. Malec, D. Mary, P. Werynski, B. Gornicka, L. Therese, and Ph. Guillot, Proc. IEEE Electrical Insulation Conference (2009) p. 377-381.
12 M. Q. Nguyen, D. Malec, D. Mary, P. Werynski, B. Gornicka, L. Therese, and P. Guillot, IEEE TRNS. DIELECTR. ELECTR. INSUL., 17, 5 (2010).   DOI
13 G. Zhang, T. Lin, L. Zhang, and G. Wu, Proc. IEEE International Conf., 2, 904-907 (2004).
14 F. Guastavino and A. Ratto, IEEE Electrical Insulation Magazine, 28, 4, 35-41 (2012). [DOI: http://dx.doi.org/10.1109/MEI.2012.6232008]   DOI