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http://dx.doi.org/10.4313/JKEM.2013.26.9.662

A Study on the Insulation and Electrical Degradation Properties of Heat Resistance Epoxy Powder for Busduct  

Kang, Cheolhwa (Department of Fire & Disaster Engineering, International University of Korea)
Park, Ji-Koon (Department of Radiological Science, International University of Korea)
Park, Jong-Kyu (Department of Electricity, Gyeongnam Provincial Namhae College)
Ju, Hyun-Don (Department of Fire & Disaster Engineering, International University of Korea)
Kim, Hyun-Hee (Department of Fire & Disaster Engineering, International University of Korea)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.26, no.9, 2013 , pp. 662-668 More about this Journal
Abstract
Reported here are results of the mechanical and electrical properties of both of intact and thermally degraded epoxy-coated copper busducts that are made by fluidized bed process. To elucidate and compare the properties mentioned above, electrical breakdown by thermal and water aging, v-t characteristic, bending test, impact test and cross cut test are carried out. Although the performance of electrical and mechanical properties are gradually decreased in increasing the severe conditions such as temperature, aging time, and so forth, sample C has a better performance in both mechanical and electrical properties.
Keywords
Compact busduct; Epoxy powder; Fluidized bed process; Degradation; Breakdown strength;
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  • Reference
1 C. Maggana and P. Pissis, J. Polym. Sci.: Part B, Polym. Phys., 37, 1165 (1999).   DOI   ScienceOn
2 B. S. Lee, I. K. Song, J. B. Lee, and S. O. Han, J. KIEEME, 16, 1136 (2003).
3 KS C IEC 60243-1, 2 (2002).
4 G. Z. Xiao and M. E. R. Shanahan, J. Polym. Sci: Part B, Polym. Phys., 35, 2659 (1998).
5 R. A. Perthric, E. A. Holins, I. McEwan, E. A. Pollock, and D. Hayward, Polymer International, 39, 275 (1996).   DOI   ScienceOn
6 J. S. White, Technometrics, 11, 373 (1969).   DOI   ScienceOn
7 V. Ashworth and Fairhurst, J. Electrochem. Soc., 124, 506 (1977).   DOI
8 S. H. Kim, J. O. Choi, D. O. Kim, and H. H. Kim, J. KIEEME, 22, 210 (2009).
9 K. Strzelec and P. Pospiech, Prog. in Organic Coatings, 63, 133 (2008).   DOI   ScienceOn
10 K. C. Agrawal (Elsevier, 2001) p. 916
11 Kumar, G.V.N. Amarnath, J. Singh, and B. P. Chowdary (India Conference, 200, Annual IEEE/2, 2008) p. 465.
12 A. M. Matawie and E. M. Sadek, Polym. Adv. Technol., 10, 223 (1999).   DOI   ScienceOn
13 J. H. Bae and H. J. Kim, The Transactions of the Korean Institute of Electrical Engineers B, 55, 628 (2006).
14 S. Skale, V. Dolecek, and M. Slemnik, Prog. in Organic Coatings, 62, 387 (2008).   DOI   ScienceOn