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http://dx.doi.org/10.4313/JKEM.2013.26.9.656

A Study on Electrical Degradation Properties of Epoxy Resin due to Moisture Absorption  

Lee, Sung Ill (Department of Safety Engineering, Korea National University of Transportation)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.26, no.9, 2013 , pp. 656-661 More about this Journal
Abstract
In this study, the moisture content, charge discharge current, electrostatic capacity and dielectric loss tangent are measured for the specimen of bisphenol type epoxy resin which is mixed with squared amorphous silica filler and dipped in hot water of $50^{\circ}C$ for 169 days. The results of this study are listed below. The longer of deposition day, the charge and discharge current was increased. It is considered that the reason is because there was water attack through the squared silica surface. The longer of deposition day, the absorption rate of all specimens was increased. It found that the absorption rate reached saturated state after 100 days. The higher frequency and the longer of deposition day, the $tan{\delta}$ was decreased. Also, It found that the $tan{\delta}$ and electrostatic capacity of the specimen which is mixed with squared filler are greater.
Keywords
Moisture content; Charge.discharge current; Electrostatic capacity; Dielectric loss tangent;
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