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http://dx.doi.org/10.4313/JKEM.2012.25.11.895

Thermal, Mechanical, and Electrical Properties for EMNC_60 and EMNC_65  

Park, Jae-Jun (Department of Electrical Electronic Engineering, Joongbu University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.25, no.11, 2012 , pp. 895-901 More about this Journal
Abstract
In order to application for high voltage heavy electric equipments, epoxy/microsilica 60 wt%/nano layered silicate composites (EMNC_60) and epoxy/microsilica 65 wt%/nano layered silicate composites (EMNC_65) respectively was synthesized by our electric field dispersion method and the result was obtained completely dispersion state. Thermal properties such as glass transition temperature (Tg) and thermal expansion coefficient, and DMA characteristics were studied, and mechanical properties such as tensile and flexural tests were performed. AC electrical insulation strength was also tested. The study on thermal property, EMNC_65 was better than EMNC_60 and mechanical, electrical properties much improved EMNC_60 compared with EMNC_65.
Keywords
Electric fields dispersion; EMNC (epoxy/micro/nano mixture composites); High voltage heavy electric equipment; Epoxy resins;
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1 J. Y. Lee, M. J. Shim, and S. W. Kim, Polym. Eng. Sci., 39,1993(1999)   DOI
2 T. Seckin, A. Gultek, M. G. Icduygu, and Y. Onal, J. Appl. Polym. Sci., 84, 164 (2002).   DOI
3 F. Lin, G. S. Bhatia, and J. D. Ford, J. Appl. Polym. Sci., 49, 1901 (1993).   DOI
4 J. Y. Lee and H. K. Lee, Mater. Chem. Phys., 85, 410 (2004).   DOI
5 D. J. Suh and O. O. Park, J. Appl. Polym. Sci., 83, 2143 (2002).   DOI
6 L. Zhang, Y. Wang, Y. Wang, Y. Sui, and D. Yu, J. Appl. Polym. Sci., 78, 1873 (2000).   DOI   ScienceOn
7 K. Varlot, E. Reynaud, M. H. Kloppfer, G. Vigler, and J. Varlet, J. Polym. Sci.: Part B39, 1360 (2001).
8 J. J. Park, S. S. Kwon, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 135 (2011).   DOI
9 T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako, and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 445 (2006).   DOI   ScienceOn
10 C. Zou, J. C. Fothergill, and S. W. Rowe, IEEE Trans. Dielectr. Electr. Insul., 15, 106 (2008).   DOI
11 J. J. Park, C. H. Lee, J. Y. Lee, and H. D. Kim, IEEE Trans. Dielectr. Electr. Insul., 18, 667 (2011)   DOI   ScienceOn
12 J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul., 17, 1516 (2010).   DOI   ScienceOn
13 R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mat. Sci. Eng., A445, 567 (2007).
14 T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 319 (2006).   DOI   ScienceOn
15 L. E. Nielsen, Particulate-filled Materials (Marcel Dekker, New York, 1974) p. 379.
16 J. K. Nelson and J. C. Fothergill, Nanotechnology, 15, 586 (2004).   DOI
17 S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 15, 12 (2008).   DOI