1 |
J. Y. Lee, M. J. Shim, and S. W. Kim, Polym. Eng. Sci., 39,1993(1999)
DOI
|
2 |
T. Seckin, A. Gultek, M. G. Icduygu, and Y. Onal, J. Appl. Polym. Sci., 84, 164 (2002).
DOI
|
3 |
F. Lin, G. S. Bhatia, and J. D. Ford, J. Appl. Polym. Sci., 49, 1901 (1993).
DOI
|
4 |
J. Y. Lee and H. K. Lee, Mater. Chem. Phys., 85, 410 (2004).
DOI
|
5 |
D. J. Suh and O. O. Park, J. Appl. Polym. Sci., 83, 2143 (2002).
DOI
|
6 |
L. Zhang, Y. Wang, Y. Wang, Y. Sui, and D. Yu, J. Appl. Polym. Sci., 78, 1873 (2000).
DOI
ScienceOn
|
7 |
K. Varlot, E. Reynaud, M. H. Kloppfer, G. Vigler, and J. Varlet, J. Polym. Sci.: Part B39, 1360 (2001).
|
8 |
J. J. Park, S. S. Kwon, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 135 (2011).
DOI
|
9 |
T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako, and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 445 (2006).
DOI
ScienceOn
|
10 |
C. Zou, J. C. Fothergill, and S. W. Rowe, IEEE Trans. Dielectr. Electr. Insul., 15, 106 (2008).
DOI
|
11 |
J. J. Park, C. H. Lee, J. Y. Lee, and H. D. Kim, IEEE Trans. Dielectr. Electr. Insul., 18, 667 (2011)
DOI
ScienceOn
|
12 |
J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul., 17, 1516 (2010).
DOI
ScienceOn
|
13 |
R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mat. Sci. Eng., A445, 567 (2007).
|
14 |
T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 319 (2006).
DOI
ScienceOn
|
15 |
L. E. Nielsen, Particulate-filled Materials (Marcel Dekker, New York, 1974) p. 379.
|
16 |
J. K. Nelson and J. C. Fothergill, Nanotechnology, 15, 586 (2004).
DOI
|
17 |
S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 15, 12 (2008).
DOI
|