1 |
J. J. Park and J. Y. Lee, IEEE Trns. Dielectr. Electr. Insul., 17, 1516 (2010).
DOI
ScienceOn
|
2 |
B. Wetzel, F. Haupert, and M. Q. Zhang, Compos. Sci. Technol., 63, 2055 (2003).
DOI
|
3 |
J. A. Kim, D. G. Seong, T. J. Kang, and J. R. Youn. Carbon, 44, 1898 (2006).
DOI
|
4 |
S. Deng, L. Ye, and K. Friedrich, J. Mater. Sci., 42, 2766 (2007).
DOI
|
5 |
A. Yasmin, J. J. Luo, J. L. Abot, and I. M. Daniel, Compos. Sci. Technol., 66, 2415 (2006).
DOI
ScienceOn
|
6 |
H. J. Song and Z. Z. Zhang, Tribol. Int., 41, 396 (2008).
DOI
|
7 |
S. W. Choi and J. J. Park, J. KIEEME, 25, 798 (2012).
|
8 |
M. Z. Rong, Q. Y. Zhang, X. H. Zheng, M. Zeng, R. Walter, and K. Friedrich, Polymer, 42, 167 (2001).
DOI
|
9 |
B. Suresha, B. N. R. Kumar, M. Venkataramareddy, and T. Jayaraju, Mater. Design, 31, 1993 (2010).
DOI
|
10 |
F. Hussain, J. Chen, and M. Hojjati, Mater. Sci. Eng., A445, 467 (2007).
|
11 |
L. E. Nielsen, Particulate-filled Materials (Marcel Dekker, New York, 1974) p. 379.
|
12 |
S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 15, (2008).
|
13 |
T. Imai, F. Sawa, T. Ozaki, Y. Inoue, T. Shimizu, and T. Tanaka, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 306 (2006).
|
14 |
Y. Hu, R. C. Smith, J. K. Nelson, and L. S. Schadler, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 31 (2006).
|
15 |
T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 12, 914 (2005).
DOI
|
16 |
P. O. Henk, T. W. Kortsen, and T. Kvarts, High Perform. Polym., 11, 281 (1999).
DOI
|
17 |
A. A. Wazzan, H. A. Al-Turaif, and A. F. Abdelkader, Polym-Plast Technol. Eng., 45, 1155 (2006).
DOI
ScienceOn
|
18 |
M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagher alavi, M. M. S. Shrazi, and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
|
19 |
P. Bajaj, N. K. Jha, and A. Kumar, J. Appl. Polym. Sci., 56, 1339(1995).
DOI
ScienceOn
|
20 |
Y. Xu, D. D. L. Chung, and C. Mroz, Compos. Pt., A32, 1749 (2001).
|
21 |
B. Wetzel, F. Haupert, and M. Q. Zhang, Compos. Sci. Technol., 63, 2055 (2003).
DOI
|
22 |
Y. Dong, D. Chaudhary, C. Ploumis, and K. T. Lau, Compos. Pt., A42, 1483 (2011).
|
23 |
T. W. Dakin, IEEE Trans. Dielectr. Electr. Insul., EI-9, 121 (1974).
DOI
|
24 |
J. Sato, O. Sakaguchi, N. Kubota, S. Makishima, S. Kinoshita, T. Shioiri, T. Yoshida, M. Miyagawa, M. Homma, and E. Kaneko, IEEE/PES Transmission and Distribution Conference and Exhibition: Asia Pacific, 3, 1791 (2002).
|
25 |
T. Shimizu, S. Kinoshita, S. Makishima, J. Sato, and O. Sakaguchi, IEEE 7th Intern. Conf. Properties and Application of Dielectric Materials (ICPADM), S22-5, 1194 (2003).
|
26 |
J. J. Park, K. G. Yoon, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 98 (2011).
DOI
|
27 |
T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Transactions on Dielectrics and Electrical Insulation, 13, 319 (2006).
DOI
ScienceOn
|
28 |
P. L. Teh, M. Mariatti, H. M. Akil, C. K. Yeoh, K.N. Seetharamu, A. N. R. Wagiman, and K. S. Behc, Mater. Lett., 61, 2156 (2007).
DOI
ScienceOn
|
29 |
J. J. Park, C. H. Lee, J. Y. Lee, and H. D. Kim, IEEE Trns. Dielectr. Electr. Insul., 18, 667 (2011).
DOI
ScienceOn
|