Browse > Article
http://dx.doi.org/10.4313/JKEM.2012.25.11.886

Properties of EMNC According to Addition Contents Variation for Nanosilica (2) -For Mechanical, Electrical Properties  

Park, Jae-Jun (Department of Electrical Electronic Engineering, Joongbu University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.25, no.11, 2012 , pp. 886-894 More about this Journal
Abstract
In order to develop electrical insulation materials, epoxy-nanosilica-microsilica mixture composites (ENMC) was synthesized, and mechanical properties such as their tensile and flexural strength, and AC insulation breakdown strength were investigated. Properties of mechanical strength and AC insulation breakdown strength are analyzed as scale and shape parameter with respect to weibull plot. Their tensile and flexural strength, AC insulation breakdown strength were compared original epoxy or EMC to ENMC. The 4 phr nano-silica addition and the 65 wt% micron-silica mixture composite (ENMC) was found to have the highest tensile and flexural strength. In the tensile strength was improved 29%, and flexural strength was improved 60.9% higher than those of the original epoxy. In the insulation breakdown strength, ENMC_4 phr was improved 17% and ENMC_5 phr was improved 15.8% higher than those of the EMC.
Keywords
Nano silica; Epoxy resin; Insulation breakdown strength; Tensile strength; Flexural strength; Epoxy-nanosilica-microsilica mixture composites (ENMC);
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 J. J. Park and J. Y. Lee, IEEE Trns. Dielectr. Electr. Insul., 17, 1516 (2010).   DOI   ScienceOn
2 B. Wetzel, F. Haupert, and M. Q. Zhang, Compos. Sci. Technol., 63, 2055 (2003).   DOI
3 J. A. Kim, D. G. Seong, T. J. Kang, and J. R. Youn. Carbon, 44, 1898 (2006).   DOI
4 S. Deng, L. Ye, and K. Friedrich, J. Mater. Sci., 42, 2766 (2007).   DOI
5 A. Yasmin, J. J. Luo, J. L. Abot, and I. M. Daniel, Compos. Sci. Technol., 66, 2415 (2006).   DOI   ScienceOn
6 H. J. Song and Z. Z. Zhang, Tribol. Int., 41, 396 (2008).   DOI
7 S. W. Choi and J. J. Park, J. KIEEME, 25, 798 (2012).
8 M. Z. Rong, Q. Y. Zhang, X. H. Zheng, M. Zeng, R. Walter, and K. Friedrich, Polymer, 42, 167 (2001).   DOI
9 B. Suresha, B. N. R. Kumar, M. Venkataramareddy, and T. Jayaraju, Mater. Design, 31, 1993 (2010).   DOI
10 F. Hussain, J. Chen, and M. Hojjati, Mater. Sci. Eng., A445, 467 (2007).
11 L. E. Nielsen, Particulate-filled Materials (Marcel Dekker, New York, 1974) p. 379.
12 S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 15, (2008).
13 T. Imai, F. Sawa, T. Ozaki, Y. Inoue, T. Shimizu, and T. Tanaka, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 306 (2006).
14 Y. Hu, R. C. Smith, J. K. Nelson, and L. S. Schadler, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 31 (2006).
15 T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 12, 914 (2005).   DOI
16 P. O. Henk, T. W. Kortsen, and T. Kvarts, High Perform. Polym., 11, 281 (1999).   DOI
17 A. A. Wazzan, H. A. Al-Turaif, and A. F. Abdelkader, Polym-Plast Technol. Eng., 45, 1155 (2006).   DOI   ScienceOn
18 M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagher alavi, M. M. S. Shrazi, and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
19 P. Bajaj, N. K. Jha, and A. Kumar, J. Appl. Polym. Sci., 56, 1339(1995).   DOI   ScienceOn
20 Y. Xu, D. D. L. Chung, and C. Mroz, Compos. Pt., A32, 1749 (2001).
21 B. Wetzel, F. Haupert, and M. Q. Zhang, Compos. Sci. Technol., 63, 2055 (2003).   DOI
22 Y. Dong, D. Chaudhary, C. Ploumis, and K. T. Lau, Compos. Pt., A42, 1483 (2011).
23 T. W. Dakin, IEEE Trans. Dielectr. Electr. Insul., EI-9, 121 (1974).   DOI
24 J. Sato, O. Sakaguchi, N. Kubota, S. Makishima, S. Kinoshita, T. Shioiri, T. Yoshida, M. Miyagawa, M. Homma, and E. Kaneko, IEEE/PES Transmission and Distribution Conference and Exhibition: Asia Pacific, 3, 1791 (2002).
25 T. Shimizu, S. Kinoshita, S. Makishima, J. Sato, and O. Sakaguchi, IEEE 7th Intern. Conf. Properties and Application of Dielectric Materials (ICPADM), S22-5, 1194 (2003).
26 J. J. Park, K. G. Yoon, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 98 (2011).   DOI
27 T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Transactions on Dielectrics and Electrical Insulation, 13, 319 (2006).   DOI   ScienceOn
28 P. L. Teh, M. Mariatti, H. M. Akil, C. K. Yeoh, K.N. Seetharamu, A. N. R. Wagiman, and K. S. Behc, Mater. Lett., 61, 2156 (2007).   DOI   ScienceOn
29 J. J. Park, C. H. Lee, J. Y. Lee, and H. D. Kim, IEEE Trns. Dielectr. Electr. Insul., 18, 667 (2011).   DOI   ScienceOn