Browse > Article
http://dx.doi.org/10.4313/JKEM.2011.24.6.463

Resonant Displacement and Piezoelectric Properties of Thickness Shear Mode Piezoelectric Devices According to Length/Thickness Ratio  

Park, Min-Ho (Department of Electrical Engineering, Semyung University)
Yoo, Ju-Hyun (Department of Electrical Engineering, Semyung University)
Hong, Jae-Il (Department of Electrical Information Control, Dongseoul College)
Jeong, Yeong-Ho (Department of Electrical Engineering, Chungju National University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.24, no.6, 2011 , pp. 463-467 More about this Journal
Abstract
In this study, thickness shear mode piezoelectric devices for AE sensor with excellent displacement and sensitivity characteristics were simulated using ATILA FEM program, and then fabricated. Displacement and electro mechanical coupling factors of the piezoelectric devices were investigated. The simulation results showed that excellent displacement and electromechanical coupling factor was obtained when the ratio of Length/Thickness was 1. The piezoelectric device of L/T= 1 exhibited the optimum values of fr= 150 kHz, displacement= $6.23{\times}10^{-8}$[m], $k_{15}$= 0.598. The results show that the thickness shear mode piezoelectric device is a promising candidate for the application of AE sensor piezoelectric device.
Keywords
AE sensor; Shear mode; PZT; ATILA;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 J. Hong, Y. Jeong, and J. Yoo, J. KIEEME, 13, 502 (2000).   과학기술학회마을
2 J. Yoo, G. Lee, and J. I. Hong, J. KIEEME, 20, 218 (2007).   과학기술학회마을
3 B. Kim and Y. Kim, Journal of the Korean Society for Nondestrctive Testing, 12, 4 (1992).
4 H. Manabu, H. Takuya, T. Hiroaki, and T. Takaaki. Jpn. J. Appl. Phys., 49, 09MD04 (2010).   DOI
5 Z. Ruzhong, W. Min, M. Bing, F. Jian, and L. Tao, J. Phys. Chem. Solids., 70, 750 (2009).   DOI
6 P. Jue, C. Jinghong, L. Haosu, H. Tianhou, H. Haiqing, and L. D. Jeong, Solid. State. Commun., 130, 53 (2004).   DOI