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http://dx.doi.org/10.4313/JKEM.2010.23.1.010

Control of Contact Angle by Surface Treatment using Sanning Plasma Method  

Kim, Young-Gi (전북대학교 전기공학과)
Choi, Byoung-Jung (전북대학교 전기공학과)
Yang, Sung-Chae (전북대학교 전기공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.23, no.1, 2010 , pp. 10-13 More about this Journal
Abstract
The plasma processing technologies of thin film deposition and surface treatment technique have been applied to many industrial fields. This study is purposed Large-area uniformity and surface treatment on the stainless substrate. We treat surface of stainless by $CF_4$ plasma. $CF_4$ plasma is generated by using SPM(Scanning plasma method)which is kind a of CVD. Generally, SPM has been used for uniform surface treatment using a crossed electromagnetic field. The optimum discharge condition has been studied for the gas pressure, the magnetic flux density and the distance between substrate and electrodes. In result, contact angle is increased by surface treatment using $CF_4$ Plasma. Therefore we expect that SPM to control contact angle is applied to many industries.
Keywords
SPM(Scanning plasma method); $CF_4$ Plasma; Contact angle;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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