Properties of Dielectric Constant and Bonding Mode of Annealed SiOCH Thin Film |
Kim, Jong-Wook
(청주대학교 전자공학과)
Hwang, Chang-Su (공군사관학교 물리학과) Park, Yong-Heon (공군사관학교 물리학과) Kim, Hong-Bae (청주대학교 전자정보공학부) |
1 | A. Grill, 'Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-k to extreme low-k interconnect materials', J. of Applied Physics, Vol. 93, p. 1785, 2003 DOI ScienceOn |
2 | I. H. Yi, C. S. Hwang, and H. B. Kim, 'A study of the dielectric characteristics of the low-k SiOCH thin films', J. of KIEEME(in Korean), Vol. 21, No. 12, p. 1083, 2008 과학기술학회마을 DOI ScienceOn |
3 | S. Y. Jing, H.-J. Lee, and C. K. Choi, 'Chemical bond structure on Si-O-C composite films with a low dielectric constant deposited by using inductively coupled plasma chemical vapor deposition', J. of Korean Physical Society, Vol. 41, p. 769, 2002 ScienceOn |
4 | Oh, T., Kim, H. S., Oh, S. B., and Won, M. S., 'Chemical shift determined according to flow rate ration . BTMSM by fourier transform infrared spectra and x-ray photoelectron spectroscopy', Jpn. J. Appl. Phys., Vol. 42, p. 6292, 2003 DOI ScienceOn |
5 | C. H. Ting and T. E. Seidel, 'Methods and needs for low-k material research', Mat. Res. Symp. Proc., Vol. 381, p. 3, 1995 DOI |
6 | Y. H. Kim, S.-K. Lee, and H. J. Kim, 'Low-k Si-O-C-H composite films prepared by plasma-enhanced chemical vapor deposition using bis-trimethylsilymethane precursor', J. Vac. Sci. Tech. A, Vol. 18(4), Part 2, p. 1216, 2000 DOI ScienceOn |
7 | Y. H. Kim, 'Deposition and characterization of low-dielectric-constant SiOCH thin films for interlayer dielectrics of multilevel interconnection', Ph.D. Dissertation, Seoul National University, 2002 |
8 | Nara, A. and Itoh, H., 'Low dielectric constant insulator formed by downstream plasma CVD at room temperature using TMS/', Jpn. J. Appl. Phys., Vol. 36, p. 1477, 1997 DOI ScienceOn |
9 | Grill, A. and Patel, V., 'Low dielectric constant SiCOH films as potential cadidates for interconnect dielectrics', Mat. Res. Soc. Symp. Proc., Vol. 565, p. 107, 1999 DOI ScienceOn |
10 | T. Oh and H. B. Kim, 'Properties of organic thin-flim transistors on hybrid-type interlayer dielectric materials', J. of Korean Physical Society, Vol. 49, p. 865, 2005 ScienceOn |
11 | Grill, A. and Deborah A, 'Structure of low dielectric constant to extreme low dielectric constant SiOCH films : Fourier transform ingrared spectroscopy characterization', Journal of Applied Physics, Vol. 94, No. 10, p. 6697, 2003 DOI ScienceOn |
12 | J. W. Kim, C. S. Hwang, and H. B. Kim, 'Properties of SiOCH thin film bonding mode by BTMSM/ flow rates', J. of KIEEME (in Korean), Vol. 21, No. 4, p. 354, 2008 과학기술학회마을 DOI ScienceOn |
13 | Grill, A., Perraud, L., Patel, V., Jahnes, C., and Cohen, S., 'Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition', Applied Physics Letters, Vol. 79, p. 803, 2001 DOI ScienceOn |
14 | W. W. Lee and P. S. Ho, 'Low dielectric constant materials for ULSI interlayer dielectric applications', MRS Bulletin, Vol. 22, No. 10, p. 19, 1997 DOI ScienceOn |
15 | S. P. Muraka, 'Low dielectric constant materials for interlayer dielectric applications', Solid State Technology, Vol. 39, No. 3, p. 34, 1996 |