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http://dx.doi.org/10.4313/JKEM.2008.21.7.669

Bending Effects of ITO Thin Film Deposited on the Polymer Substrate  

Kim, Sang-Mo (경원대학교 전기공학과)
Rim, You-Seung (경원대학교 전기공학과)
Choi, Hyung-Wook (경원대학교 전기공학과)
Choi, Myung-Gyu (경원대학교 전기공학과)
Kim, Kyung-Hwan (경원대학교 전기공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.21, no.7, 2008 , pp. 669-673 More about this Journal
Abstract
ITO thin film was deposited on PC substrate in Facing Targets Sputtering (FTS) system with various sputtering conditions. After it is applied to external bending force, we investigated how change the surface and electrical property of as-deposited ITO thin film. As the L(face-plate distance) of substrate decreases, it found that the maximum crack density is increasing at the center position and decreasing crack density as goes to the edge. So to apply same curvature (r) and bending force to PC substrate with ITO thin film, we fixed the L that is equal to curvature radius (2r). Before bending test, ITO thin films that deposited in the input current of 0.4 A and thickness of 200 nm already had biaxial tensile failure because of each different CTE (Coefficient of Thermal Expansion) and Others had been shown no bending or crack. After bending test, all samples had been shown cracks at about 200 times and as increasing the crack density, resistivity increased.
Keywords
FTS; ITO; Bending; PC;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
연도 인용수 순위
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