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http://dx.doi.org/10.4313/JKEM.2006.19.8.754

Improvement of Permeation of Solvent-free Multi-layer Encapsulation of Thin Films on Polyethylene Terephthalate (PET)  

Han Jin-Woo (연세대학교 전기전자공학과)
Kang Hee-Jin (연세대학교 전기전자공학과)
Kim Jong-Yeon (연세대학교 전기전자공학과)
Seo Dae-Shik (연세대학교 전기전자공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.19, no.8, 2006 , pp. 754-757 More about this Journal
Abstract
The inorganic multi-layer thin film encapsulation was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Polyethylene Terephthalate (PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON, $SiO_2$ and parylene layer showed the most suitable properties. Under these conditions, the WVTR for PET can be reduced from level of $0.57g/m^2/day$ (bare subtrate) to $1*10^{-5}g/m^2/day$ after application of a SiON and $SiO_2$ layer. These results indicates that the $PET/SiO_2/SiON/Parylene$ barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.
Keywords
SiON; $SiO_2$; Parylene; Multi-layer; Encapsulation;
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