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http://dx.doi.org/10.4313/JKEM.2005.18.9.798

Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring  

Ju, Chul-Won (한국전자통신연구원 기반기술연구소)
Lee, Kyung-Ho (한국전자통신연구원 기반기술연구소)
Min, Byoung-Gue (한국전자통신연구원 기반기술연구소)
Kim, Seong-Il (한국전자통신연구원 기반기술연구소)
Lee, Jong-Min (한국전자통신연구원 기반기술연구소)
Kang, Young-il (한국전자통신연구원 기반기술연구소)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.18, no.9, 2005 , pp. 798-802 More about this Journal
Abstract
The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $\pm16.6\%,\;\pm4\%$ respectively.
Keywords
Solder bump; Flip chip; Electroplating; Ring contact;
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