Characteristics of Friction Affecting CMP Results
![]() |
Park, Boumyoung
(부산대학교 정밀기계공학과)
Lee, Hyunseop (부산대학교 정밀기계공학과) Kim, Hyoungjae (부산대학교 정밀기계공학과) Seo, Heondeok (부산대학교 정밀기계공학과) Kim, Gooyoun (부산대학교 정밀기계공학과) Jeong, Haedo (부산대학교 기계공학부) |
1 | A. K. Sikder, F. Gigio, ]. Wood, A. Kumar, and M. Anthony, 'Optimization of tribology properties of silicon dioxide during the chemical mechanical planarization process', J. of Electronic materials, Vol. 30, No. 12, p. 1520, 2001 DOI ScienceOn |
2 | 김상용, 서용진, 이우선, 장의구, '실리콘 웨이퍼위에 증착된 실리케이트 산화막의 CMP 슬러리 오염 특성', 전기전자재료학회논문지, 13권, 2호, p. 131, 2000 |
3 | M. Tomozawa, 'Oxide CMP mechanisms', Solid State Technology, p. 169, 1977 |
4 | J. M. Steigerwarld, 'Chemical mechanical planarization of microelectronic materials', John Wiley & Sons, p. 129, 1997 |
5 | B. Bhushan. 'Principles applications of tribology', John Wiley & Sons, p. 1. 1999 |
6 | K. C. Ludema, 'Friction, wear, lubrication', CRC Press, p. 111. 1996 |
7 | P. Powell, 'Engineering with polymers', Champman and Hall, p. 89, 1983 |
8 | H. D. Seo, S. H. Lee, and H. D. Jeong, 'Characterization of the composite conditioning aided by ultrasonic vibration', Electrochemical Society Proceedings, Vol. 99-37, p. 445, 2000 |
9 | G. W. Stachowiak, 'Engineering Tribology', Elsevier, p. 561, 1993 |
10 | 김상용, 서용진, 이우선, 이강현, 장의구, '슬러리와 패드 변화에 따른 텅스텐 플러그 CMP 공정의 최적화', 전기전자재료학회 논문지, 13권, 7호, p. 568, 2000 |
11 | D. Wang, ]. Lee, K. Holland, T. Bibby, S. Beaudoin, T. Cale, 'Von-rnises stress In chemical mechanical polishing process', J. of Electrochemical Society, Vol. 144(4), p. 1121, 1997 DOI |
12 | N. Chandrasekaran, 'Material removal mechanism of oxide and nitride CMP with ceria and silica-based slurries-analysis of slurry particles pre- and post-dielectric CMP', Materials Research Society Proceeding, Vol. 816, p. K9.2.1, 2004 |
![]() |