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http://dx.doi.org/10.4313/JKEM.2003.16.5.404

Characterization of Embedded Inductors using Partial Element Equivalent Circuit Models  

신동욱 (연세대학교 전기전자공학과)
오창훈 (연세대학교 전기전자공학과)
이규복 (전자부품연구원 무선회로연구센터)
김종규 (전자부품연구원 무선회로연구센터)
윤일구 (연세대학교 전기전자공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.16, no.5, 2003 , pp. 404-408 More about this Journal
Abstract
The characterization for several multi-layer embedded inductors with different structures was investigated. The optimized equivalent circuit models for several test structures were obtained from HSPICE. Building blocks are modeled using Partial element equivalent circuit method. The mean and the standard deviation of model parameters were extracted and predictive modeling was performed on different test structure. From this study, the characteristic of multi-layer inductors can be predicted.
Keywords
Integrated inductors; Embedded passives; Circuit model; PEEC; LTCC;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 Extraction of passive device model parameters using genetic algorithms /
[ I.Yun;L.A.Carastro;R.Poddar;M.A.Brooke;G.S.May;K.Hyun;K.Pyun ] / ETRI Journ.   과학기술학회마을   DOI   ScienceOn
2 /
[ D.M.Pozar ] / Microwave Engineering
3 Embedded passive components for MCM /
[ L.J.Golonka;K.J.Wolter;A.Dziedzic;J.Kita;L.Rebenklau ] / 24th International Spring Seminar on Electronic Technology
4 Three-dimensional interconnect analysis using partial element equivalent circuits /
[ H.Heeb;A.E.Ruehli ] / IEEE Trans. Cir. Sys.Ⅰ   DOI
5 The integration of passive components into MCMs using advanced low-temperature cofired ceramics /
[ R.L.Brown;A.A.Shapiro;P.W.Polinski ] / The Int. Journ. of Microcircuits and Electron Packaging
6 구조변화에 따른 LTCC 매립형 인덕터 등가모델 연구 /
[ 오창훈;신동욱;이규복;김종규;윤일구 ] / 전기전자재료학회 2002하계학술대회논문집
7 저온 동시소성 공정으로 제작된 3차원 매립 인덕더 모델링 /
[ 이서구;최종성;윤일구 ] / 전기전자재료학회논문지   과학기술학회마을   DOI   ScienceOn
8 3차원 매립형 수동소자에 대한 통계적 분석 /
[ 신동욱;오창훈;이규복;김종규;윤일구 ] / 전기전자재료학회 2002하계학술대회논문집
9 Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC Process /
[ R.Poddar;M.Brooke ] / IEEE Trans. Advanced Packaging   DOI   ScienceOn