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http://dx.doi.org/10.5229/JKES.2022.25.3.113

Effect of Polyethylene Glycol on Cu Electrodeposition  

An, Eui Gyeong (Department of Chemical Engineering, Kumoh National Institute of Technology)
Choi, Sun Gi (Department of Chemical Engineering, Kumoh National Institute of Technology)
Lee, Jaewon (Department of Chemical Engineering, Kumoh National Institute of Technology)
Cho, Sung Ki (Department of Chemical Engineering, Kumoh National Institute of Technology)
Publication Information
Journal of the Korean Electrochemical Society / v.25, no.3, 2022 , pp. 113-118 More about this Journal
Abstract
In this study, the effect of polyethylene glycol (PEG) on Cu electrodeposition was analyzed using cyclic voltammetry. The adsorption of PEG was affected by the specific adsorption of sulfate ion (SO42-) or chloride ion (Cl-). In SO42--based plating solution, the adsorption of PEG was limited by the adsorbed SO42-. Accordingly, the adsorbed PEG could suppress the electron transfer for Cu electrodeposition, but its effect was not significant. Meanwhile, in the plating solution composed of perchlorate ion (ClO4-) which does not specifically adsorb on Cu surface, a strong suppression effect of PEG was observed and it was proportional to the molecular weight of PEG. On the other hand, when Cl- was specifically adsorbed on Cu surface, the suppression effect of PEG was enhanced because PEG and Cl- formed an interrelated adsorbate. The synergetic effect of PEG and Cl- depended on the composition of the plating solution, which means that the synergy between PEG and Cl- is based on the physical interaction. For example, the hydrophobicity of PEG plays an important role in the interaction, as the suppression effect of PEG derivative having a hydrocarbon tail was further enhanced with the addition of Cl-.
Keywords
Cu Electrodeposition; Additive; Polyethylene Glycol; Suppressor;
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