1 |
S. K. Kim, M.-C. Kang, H.-C. Koo, S. K. Cho, J. J. Kim, and J.-K. Yeo, Cu metallization for giga level devices using electrodeposition, J. Korean Electrochem. Soc., 10, 94 (2007).
DOI
|
2 |
S. K. Kim, D. Josell, and T. P. Moffat, Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system, J. Electrochem. Soc., 153, C616 (2006).
DOI
|
3 |
Y. E. Jo, D. Y. Yu, and S. K. Cho, Revealing the inhibition effect of quaternary ammonium cations on Cu electrodeposition, J. Appl. Electrochem., 50, 245 (2020).
DOI
|
4 |
A. Frank and A. J. Bard, The decomposition of the sulfonate additive sulfopropyl sulfonate in acid copper electroplating chemistries, J. Electrochem. Soc., 150, C244 (2003).
DOI
|
5 |
O. M. Magnussen, Ordered anion adlayers on metal electrode surfaces, Chem. Rev., 102, 679 (2002).
DOI
|
6 |
W.-P. Dow, H.-S. Huang, M.-Y. Yen, and H.-C. Huang, Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating, J. Electrochem. Soc., 152, C425 (2005).
DOI
|
7 |
S. K. Kim, D. Josell, and T. P. Moffat, Cationic surfactants for the control of overfill bumps in Cu superfilling, J. Electrochem. Soc., 153, C826 (2006).
DOI
|
8 |
D. Grujicic and B. Pesic, Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon, Electrochim. Acta, 50, 4426 (2005).
DOI
|
9 |
T. Y. B. Leung, M. Kang, B. F. Corry, and A. A. Gewirth, Benzotriazole as an additive for copper electrodeposition influence of triazole ring substitution, J. Electrochem. Soc., 147, 3326 (2000).
DOI
|
10 |
M. B. Gawande, A. Goswami, F.-X. Felpin, T. Asefa, X. Huang, R. Silva, X. Zou, R. Zboril, and R. S. Varma, Cu and Cu-based nanoparticles: Synthesis and applications in catalysis, Chem. Rev., 116, 3722 (2016).
DOI
|
11 |
K. Shi, K. Hu, S. Wang, C.-Y. Lau, and K.-K. Shiu, Structural studies of electrochemically activated glassy carbon electrode: Effects of chloride anion on the redox responses of copper deposition, Electrochim. Acta, 52, 5907 (2007).
DOI
|
12 |
Z. Chen and K. A. Fichthorn, Adsorption of alkylamines on Cu surfaces: identifying ideal capping molecules using first-principles calculations, Nanoscale, 13, 18536 (2021).
DOI
|
13 |
S. Aksu and F. M. Doyle, Electrochemistry of copper in aqueous ethylenediamine solutions, J. Electrochem. Soc., 149, B340 (2002).
DOI
|
14 |
Y. M. Shin, I. U. Kim, D. S. Bang, and S. K. Cho, Study on the effect of (dodecyldimethylammonio)propanesulfonate zwitterionic surfactant on Cu electrodeposition, J. Korean Electrochem. Soc., 24, 35 (2021).
DOI
|
15 |
S.-H. Liu, T. Balankura, and K. A. Fichthorn, Self-assembled monolayer structures of hexadecylamine on Cu surfaces: density-functional theory, Phys. Chem. Chem. Phys., 18, 32753 (2016).
DOI
|
16 |
C. Goletti, G. Bussetti, A. Violante, B. Bonanni, M. Di Giovannantonio, G. Serrano, S. Breuer, K. Gentz, and K. Wandelt, Cu(110) surface in hydrochloric acid solution: Potential dependent chloride adsorption and surface restructuring, J. Phys. Chem. C, 119, 1782 (2015).
DOI
|