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http://dx.doi.org/10.5229/JKES.2022.25.2.81

Study on the Effect of Alkylamines on Cu Electroplating  

Lee, Jaewon (Department of Chemical Engineering, Kumoh National Institute of Technology)
Shin, Yeong Min (Department of Chemical Engineering, Kumoh National Institute of Technology)
Bang, Daesuk (Department of Chemical Engineering, Kumoh National Institute of Technology)
Cho, Sung Ki (Department of Chemical Engineering, Kumoh National Institute of Technology)
Publication Information
Journal of the Korean Electrochemical Society / v.25, no.2, 2022 , pp. 81-87 More about this Journal
Abstract
In this study, the effect of alkylamine on copper electroplating was analyzed using cyclic voltammetry. When water-soluble alkylamines were added to the plating solution, the reduction reaction of Cu2+ was inhibited. The inhibition effect of 1,12-diaminododecane has been investigated at various concentrations and conditions of the plating solution. 1,12-diaminododecane was protonated in the acidic plating solution, and therefore, it did not act as a complexing agent for Cu2+. Accordingly, it was confirmed that the inhibiton effect of 1,12-diaminododecane was attributed to adsorption on the Cu surface. The adsorption of 1,12-diaminododecane exhibits two characteristics: (i) protonation and subsequent electrostatic attraction with anions pre-adsorbed on Cu surface, and (ii) direct adsorption on Cu surface via amine functional group. The adsorbed 1,12-diaminododecane caused three-dimensional growth and grain refining, as well as the inhibition effect, during Cu electroplating.
Keywords
Cu Electroplating; Additive; Alkylamine; Alkyldiamine; Inhibitor;
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