Browse > Article
http://dx.doi.org/10.5229/JKES.2021.24.3.35

Study on the Effect of (Dodecyldimethylammonio)propanesulfonate Zwitterionic Surfactant on Cu Electrodeposition  

Shin, Yeong Min (Department of Chemical Engineering, Kumoh National Institute of Technology)
Kim, In Ui (Department of Chemical Engineering, Kumoh National Institute of Technology)
Bang, Daesuk (Department of Chemical Engineering, Kumoh National Institute of Technology)
Cho, Sung Ki (Department of Chemical Engineering, Kumoh National Institute of Technology)
Publication Information
Journal of the Korean Electrochemical Society / v.24, no.3, 2021 , pp. 35-41 More about this Journal
Abstract
In this study, the effect of zwitterionic surfactant on Cu electrodeposition was investigated through cyclic voltammetry. With the addition of (dodecyldimethylammonio)propanesulfonate (DDAPS) as a representative zwitterionic surfactant in the electrolyte for Cu electrodeposition, the electrochemical Cu2+ reduction was inhibited on Cu and glassy carbon electrodes. Its inhibition effect was similar to that of cationic surfactant rather than anionic surfactant. Moreover, DDAPS interacted with chloride ion and exhibited the mass transfer-dependent inhibition behavior, which indicates that its inhibition function is associated with the formation of its surface aggregates on anion-covered Cu surface. In addition, adsorbed DDAPS slightly reduced the surface roughness of Cu electrodeposits. These characteristics were similar to those of cationic surfactant, but less obvious. It means the effect of DDAPS on Cu electrodeposition originates from the cationic head group which is shield by anionic head group.
Keywords
Cu electrodeposition; Additive; Zwitterionic surfactant; Cationic surfactant;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 S. K. Kim, M.-C. Kang, H.-C. Koo, S. K. Cho, J. J. Kim and J.-K. Yeo, 'Cu Metallization for Giga Level Devices Using Electrodeposition' J. Korean Electrochem. Soc., 10, 94 (2007).   DOI
2 R. Zhang and P. Somasundaran, 'Advances in adsorption of surfactants and their mixtures at solid/solution interfaces' Adv. Colloid and Interface Sci., 123-126, 213 (2006).   DOI
3 J. Kang, C. M. Kim, D. Y. Yu, Y. S. Ham, S. K. Cho and J. J. Kim, 'Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition' Trans. IMF, 97, 22 (2019).   DOI
4 Y. E. Jo, D. Y. Yu and S. K. Cho, 'Revealing the inhibition effect of quaternary ammonium cations on Cu electrodeposition' J. Appl. Electrochem., 50, 245 (2020).   DOI
5 E. Michailova, M. Peykova, D. Stoychev and A. Milchev, 'On the role of surface active agents in the nucleation step of metal electrodeposition on a foreign substrate' J. Electroanal. Chem., 366, 195 (1994).   DOI
6 S. K. Kim, D. Josell and T. P. Moffat, 'Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling' J. Electrochem. Soc., 153, C826 (2006).   DOI
7 P. Lianos and R. Zana, 'Fluorescence Probe Studies of the Effect of Concentration on the State of Aggregation of Surfactants in Aqueous Solution' J. Colloid Interf. Sci., 84, 100 (1981).   DOI
8 L. M. Grant and W. A. Ducker, 'Effect of Substrate Hydrophobicity on Surface-Aggregate Geometry: Zwitterionic and Nonionic Surfactants' J. Phys. Chem. B, 101, 5337 (1997).   DOI
9 A. E. Kaifer and A. J. Bard, 'Micellar effects on the reductive electrochemistry of methylviologen' J. Phys. Chem., 89, 4876 (1985).   DOI
10 C.-j. Cheng, G.-m. Qu, J.-j. Wei, T. Yu and W. Ding, 'Thermodynamics of Micellization of Sulfobetaine Surfactants in Aqueous Solution' J. Surfact. Deterg., 15, 757 (2012).   DOI
11 C. La Mesa, B. Sesta, M. G. Bonicelli and G. F. Ceccaroni, 'Phase Diagram of the Binary System Water-(Dodecyldimethylammonio)propanesulfonate' Langmuir, 6, 728 (1990).   DOI
12 Z. Nagy, J. P. Blaudeau, N. C. Hung, L. A. Curtiss and D. J. Zurawski, 'Chloride Ion Catalysis of the Copper Deposition Reaction' J. Electrochem. Soc., 142, L87 (1995).   DOI