Browse > Article
http://dx.doi.org/10.5229/JKES.2011.14.3.163

Study of Stress Changes in Nanocrystalline Ni Thin Films Eletrodeposited from Chloride Baths  

Park, Deok-Yong (Department of Applied Materials Engineering, Division of Advanced Materials Engineering, Hanbat National University)
Publication Information
Journal of the Korean Electrochemical Society / v.14, no.3, 2011 , pp. 163-170 More about this Journal
Abstract
Nanocrystalline Ni thin films were electodeposited from chloride baths to investigate the influences of additive concentration, current density and solution pH on residual (or internal) stress, surface morphology, and microstructure of the films. It was observed that residual stress in Ni thin film was changed from tensile stress mode (about 150 MPa) to compressive stress mode (about -100 MPa) with increasing saccharin concentration as an additive. Microstructure of Ni thin films was changed with/without saccharin in baths. Ni thin films electrodeposited from saccharinfree bath mainly consisted of both FCC(111) and FCC(200) phases. However, Ni thin film electrodeposited from the baths containing saccharin exhibited FCC(111), FCC(200) and FCC (311) phases [sometimes, FCC (220)]. Current density influenced residual stress of Ni thin films. It was measured to be the lowest compressive stress value (about-100 MPa) in range of current density of $2.5\sim10mA{\cdot}cm^{-2}$. Solution pH also influenced residual stress of Ni thin film. Addition of saccharin in baths affected grain size of Ni thin films. Grain sizes of Ni thin films were measured to be about 60 nm without saccharin and 24~38 nm with more than 0.0005M saccharin concentration. Surface of Ni thin films was changed from nodular to smooth surface morphology with addition of saccharin.
Keywords
Residual stress; Ni thin films; Electrodeposition; Nanocrystalline; MEMS/NEMS;
Citations & Related Records
연도 인용수 순위
  • Reference
1 B.-Z. Lee, D.N. Lee, "Spontaneous growth mechanism of tin whiskers", Acta Mater., 46, 3701 (1998).   DOI
2 F. Czerwinski, A. Zielinska-Lipiec, and J.A. Szpunar, "Thermal instability of ni electrodeposits applied in replication of optical recording devices" Acta Mater., 47, 2553 (1999).   DOI
3 C.A. Moina and M. Vazdar, "Electrodeposition of nanosized nuclei of magnetic Co-Ni alloys onto n-Si (100)" Electrochem. Commun., 3, 159 (2001).   DOI
4 J.W. Judy, R.S. Muller and H.H. Zappe, "Magnetic microactuation of polysilicon flexure structures" J. Microelectromech. Syst., 4(4), 162 (1995).   DOI
5 P. Zentner, Brenner, and Jennings, "Physical. properties of electrodeposited metals", Plating, 39, 865, 1229 (1952).
6 K.-N. Tu, J. W. Mayer, and L. C. Feldman (Eds.), Electronic Thin Film Science for Electrical Engineers and Materials Scientists, Macmillan Publishing Company, New York, New York, 1992, Chap. 4.
7 R. Weil, "The origins of stress in electrodeposits", Plating, 58, 50 (1971).
8 I. Kim and P.F. Mentone, "Electroformed nickel stamper for light guide panel in LCD back light unit" Electrochim. Acta, 52, 1805-1809 (2006).   DOI
9 K. Kataoka, S. Kawamura, T. Itoh, K. Ishikawa, H. Honma, and T. Suga, "Electroplating Ni micro-cantilevers for low contact-force IC probing" Sens. Actuators, A, 103, 116 (2003).
10 J. W. Judy and R. S. Muller, "Magnetically actuated, addressable microstructures" J. Microelectromech. Syst., 6, 249 (1997).   DOI
11 H. H. Yang, N. V. Myung, J. Yee, D.-Y. Park, B.-Y. Yoo, M. Schwartz, K. Nobe, and J.W. Judy, "Ferromagnetic micromechanical magnetometer" Sens. Actuators, A, 97- 98, 88 (2002).   DOI
12 S. M. Allameh, J. Lou, F. Kavishe, T. Buchheit, and W.O. Soboyejo, "An investigation of fatigue in LIGA Ni MEMS thin films", Mater. Sci. Eng., A, 371, 256 (2004).   DOI
13 M. Ya. Poperaka, Internal Stress in Electrolytically Deposited Metals, transl. from Russian, Indian National Scientific Documentation Center, New Delhi, National Bureau of Standards and the National Science Foundation, Washington, DC, 1970.
14 R. Weil, Plating, "The origins of stress in electrodeposits", 57, 1231 (1970); 58, 137 (1971).
15 J.W. Dini, Electrodeposition-The Materials Science of Coatings and Substrates, Noyes Publ. Park Ridge, NJ, 1993, pp. 339 and 331.
16 Modern Electroplating, 4th ed., G. A. Di Bari, M. Schlesinger, and M. Paunovic, Editors, pp. 139-199, Wiley-Interscience, New York (2000).
17 D.-Y. Park, K.S. Park, J.M. Ko, D.-H. Cho, S.H. Lim, W.Y. Kim, B.Y. Yoo, and N.V. Myung, "Electrodeposited Ni1−xCox nanocrystalline thin films: structure-property relationships", J. Electrochem. Soc., 153(12), C814-C821 (2006).   DOI