1 |
T. Jiang, S. Zhang, X. Qiu, W. Zhu, and L. Chen, 'Preparation and characterization of tin-based three-dimensional cellular anode for lithium ion battery' J. Power Sources 166, 503 (2007).
DOI
|
2 |
C. A. Bernardo, I. Alstrup and, J. R. Rostrup-Nielsen, 'Carbon deposition and methane steam reforming on silica-supported Ni-Cu catalysts' J. Catal., 96, 517 (1985).
DOI
|
3 |
M. Boder and R. Dittmeyer, 'Catalytic modification of conventional SOFC anodes with a view to reducing their activity for direct internal reforming of natural gas' J. Power Sources, 155, 13 (2006).
DOI
|
4 |
D. M. Soares, S. Wasle, K. G. Weil, and K. Doblhofer, 'Copper ion reduction catalyzed by chloride ions' J. Electroanal. Chem., 532, 353 (2002).
DOI
|
5 |
W. Shao and G. Zangari, 'Dendritic growth and morphology selection in copper electrodeposition from anodic sulfate solutions containg chlorides' J. Phys. Chem. C., 113, 10097 (2009).
DOI
|
6 |
Y. Tsuru, M. Nomura, and F. R. Foulkes, 'Effect of chloride, bromide and iodide ions on internal stress in films deposited during high speed nickel electroplating form a nickel sulfamate bath' J. Appl. Electrochem., 30, 231 (2000).
DOI
|
7 |
A. M. Alfantazi and A.Shakshouki, 'The effects of chloride ions on the electrowinning of nickel from sulfate electrolytes' J. Electrochem. Soc., 149(10), C506 (2002).
DOI
|
8 |
R. Qui, X. L. Zhang, R. Qiao, Y. Li, Y. I. Kim, and Y. S. Kang, 'CuNi dendritic material: Synthesis, mechanism discussion, and application as glucose sensor' Chem. Mater., 19(17), 4174 (2007).
DOI
|
9 |
Z. Nagy, J. P. Blaudeau, N. C. Hung, L. A. Curtiss, and D. J. Zurawski, 'Chloride ion catalysis of the copper deposition reaction' J. Electrochem. Soc. 142, L87 (1995).
DOI
|
10 |
A. Ollivier, L. Muhr, S. Delbos, P. P. Grand, M. Matlosz, and E. Chassaing 'Copper-nickel codeposition as a model for mass-transfer characterization in copper-indium-selenium thin-film production' J. Appl. Electrochem., 39, 2337 (2009)
DOI
|
11 |
Y. Li, W.-Z. Jia, Y.-Y. Song, and X.-H. Xia, 'Superhydrophobicity of 3D Porous Copper Films Prepared Using the Hydrogen Bubble Dynamic Template' Chem. Mater., 19, 5758 (2007).
DOI
|
12 |
H.-C. Shin, J. Dong, and M. Liu, 'Nanoporous structures prepared by and electrochemical deposition process' Adv. Mater., 15(19), 1610 (2003).
DOI
|
13 |
H.-C. Shin and M. Liu, 'Copper foam structures with highly porous nanostructured walls' Chem. Mater., 16, 5460 (2004).
DOI
|
14 |
N. D. Nikolic, K. I. Popov, Lj. J. Pavlovic, and M. G. Pavlovic, 'Morphologies of copper deposits obtained by the electrodeposition at high overpotentials' Surf. Coat. Technol., 201, 560 (2006).
DOI
|
15 |
Y. Li, Y.-Y. Song, C. Yang, and X.-H. Xia, 'Hydrogen bubble dynamic template synthesis of porous gold for nonenzymatic electrochemical detection of glucose' Electrochem. Commun., 9, 981 (2007).
DOI
|
16 |
H.-C. Shin and M. Liu, 'Three-Dimensional Porous Copper-Tin Alloy Electrodes for Rechargeable Lithium Batteries' Adv. Funct. Mater., 15(4), 582 (2005).
DOI
|