1 |
T. Park, T. Tugbawa, and D. Boning, 'Pattern Dependent Modeling of Electroplated Copper Profiles' International Interconnect Technology Conference(IITC), 274, San Francisco, CA, June (2001)
|
2 |
T. Park, Ph. D. Thesis, "Characterization and Modeling of Pattern Dependencies in Copper Interconnects for Integrated Circuits", MIT, June (2002)
|
3 |
G. A. Prentice and C. W. Tobias, 'A Survey of Numerical Methods and Solutions for Current Distribution Problems' J. Electrochemical Society. 129, 72 (1982)
DOI
ScienceOn
|
4 |
J. Newman," Electrochemical Systems", John & Wileys, New York (1991)
|
5 |
C. T. J. Low, E. P. L. Roberts and F. C. Walsh, 'Numerical Simulation of the Current, Potential and Concentration Distributions along the Cathode of Rotating Cylinder Hull Cell', Electrochimica Acta , 52, 3831 (2007)
DOI
ScienceOn
|
6 |
I. O. Dukovic, 'Computation of Current Distribution in Electrodeposition, a Review' IBM J. Res. & Devel,, 34, 693 (1990)
DOI
|
7 |
J. Deconinck, "Current Distributions and Electrode Shape Changes in Electrochemical Systems", Springer-Verlag, London (1992)
|
8 |
J. Lee and J.B. Talbot, "Simulation of Electrochemical Processes" WIT Transactions on Eng. Sci., 48, WIT Press, Boston (2005)
|
9 |
FlexPde Professional, www.PdeSolutions.com
|
10 |
M. Datta, 'Microfabrication by Electrochemical Metal Removal' IBM J. Res. & Devel,, 42, 655 (1988)
DOI
ScienceOn
|
11 |
D. Landolt, 'Electrodeposition Sciences and Technology in the Last Quater of the Twenties Century', J. Electrochemical Society, 149, S9 (2002)
DOI
ScienceOn
|
12 |
M. Narashimhan, 'Inline Process Control of Advanced Thin Films' www.kla-tencor.com/magazine, 1 (2004)
|
13 |
R. Moutton, "Three-dimensional PCB Electroplating Simulation Tools", Presented at IPC Printed Circuits EXPO, www. ipcprintedcircuitsexpo.org, S10-2-1 (2001)
|