1 |
Y. S. Jung, K. T. Lee, J. H. Ryu, D. Im, and S. M. Oh, J. Electrochem. Soc. 152, A1452 (2005)
DOI
ScienceOn
|
2 |
D. Deng and J. Y. Lee, Chem. Mater. 20, 1481 (2008)
|
3 |
M. Winter, J. O. Besenhard, Electrochim. Acta, 45, 31 (1999)
DOI
ScienceOn
|
4 |
Y. Kwon, H. Kim, S. -G. Doo, and J. Cho, Chem. Mater. 19, 982 (2007)
DOI
ScienceOn
|
5 |
Y. Sun, B. T. Mayers, and Y. Xia, Adv. Mater. 15, 641 (2003)
DOI
ScienceOn
|
6 |
Y. Sun and Y. Xia, J. Am. Chem. Soc. 126, 3892 (2004)
DOI
ScienceOn
|
7 |
Y. Hu, J. Chen, W. Chen, X. Lin, and X. Li, Adv. Mater. 15, 726 (2003)
DOI
ScienceOn
|
8 |
X. Cao, Li Gu, L. Zhuge, W. Gao, W. Wang, and S. Wu, Adv. Funct. Mater. 16, 896 (2006)
DOI
ScienceOn
|
9 |
S. -W. Kim, M. Kim, W. Y. Lee, and T. Hyeon, J. Am. Chem. Soc. 124, 7642 (2002)
DOI
ScienceOn
|
10 |
Q. Li, H. Liu, M. Han, J. Zhu, Y. Liang, Z. Xu, and Y. Song, Adv. Mater. 17, 1995 (2005)
DOI
ScienceOn
|
11 |
H. Kim, G. -S. Park, E. Kim, S. -G. Doo, and J. Cho, J. Electrochem. Soc. 153, A1633 (2006)
DOI
ScienceOn
|
12 |
E. Kim, D. Son, T. -G. Kim, J. Cho, B. Park, K. S. Ryu, and S. H. Chang, Angew. Chem. Int. Ed. 43, 5987 (2004)
DOI
ScienceOn
|
13 |
E. Kim, M. G. Kim, Y. Kim, and J. Cho, Electrochem. Solid State Lett. 8, A452 (2005)
DOI
ScienceOn
|
14 |
Y. Kwon, M. G. Kim, Y. Kim, Y. Lee, and J. Cho, Electrochem. Solid State Lett. 9, A34 (2006)
DOI
ScienceOn
|
15 |
M. Noh, Y. Kim, M. Kim, H. Lee, H. kim, Y. Kwon, Y. Lee, and J. Cho, Chem. Mater. 17, 3320 (2005)
DOI
ScienceOn
|
16 |
I. -S. Kim, G. E. Blomgren, and P. N. Kumta, Electrochem. Solid State Lett. 7, A44 (2004)
DOI
ScienceOn
|
17 |
M. Noh, Y. Kwon, H. Lee, J. Cho, Y. Kim, and M. G. Kim, Chem. Mater. 17, 1926 (2005)
DOI
ScienceOn
|
18 |
Q. Lu, Z. Liu, L. Li, S. Xie, J. Kong, and D. Zhao, Adv. Mater. 13, 286 (2001)
DOI
ScienceOn
|
19 |
C. Kim, M. Noh, M. Choi, J. Cho, and B. Park, Chem. Mater. 17, 3297 (2005)
DOI
ScienceOn
|
20 |
H. Lee, J. Cho, Nano Lett. 7, 2638 (2007)
DOI
ScienceOn
|
21 |
Y. Wang and J. Y. Lee, T. C. Deivaraj, J. Mater. Chem. 14, 362 (2004)
DOI
ScienceOn
|
22 |
H. Lee, M. G. Kim, C. H. Choi, Y. K. Sun, C. S. Yoon, and J. Cho, J. Phys. Chem. B. 109, 20719 (2005)
DOI
|
23 |
E. Kim, Y. Kim, M. G. Kim, and J. Cho, Electrochem. Solid State Lett. 9, A156 (2006)
DOI
ScienceOn
|
24 |
R. -K. Chiang and R. -T. Chiang, Inorganic Chem. 46, 369 (2007)
DOI
ScienceOn
|
25 |
Y. Sun and Y. Xia, Science 298, 2176 (2002)
DOI
ScienceOn
|
26 |
H. -P. Liang, H. -M. Zhang, J. -S. Hu, Y. -G. Guo, L. -J. Wan, and C. -L, Bai, Angew. Chem. Int. Ed. 43, 1540 (2004)
DOI
ScienceOn
|
27 |
G. S. Metraux, Y. C. Cao, R. Jin, C. A. Mirkin, Nano Lett. 3, 2003 (2003)
|
28 |
Y. Yang, M. Wachtler, M. Winter, and J. O. Besenhard, Electrochem. Solid State Lett. 2, 161 (1999)
DOI
|
29 |
T. Watanabe, Nanoplating: Microstructure control theory of plated film and data base of plated film microstructure, Elsevier Publishers, Amsterdam, Netherlands, 2004
|
30 |
H. Kim and J. Cho, Electrochim. Acta 52, 4197 (2007)
DOI
ScienceOn
|
31 |
Y. Vasquez, A. K. Sra, and R. E. Schaak, J. Am. Chem. Soc. 127, 12504 (2005)
DOI
ScienceOn
|
32 |
F. Cheng, H. Ma, Y. Li, and J. Chen, Inorganic Chem. 46, 2007 (2007)
|
33 |
H. -P. Liang, Y. -G. Guo, H. -M. Zhang, J. -S. Hu, L. -J. Wan, and C. -L. Bai, Chem. Commu. 1496 (2004)
|