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Studies on Dismantlement Property of Dismantlable Polyurethane Adhesive  

Kim, Dong Ho (Korea Institute of Footwear & Leather Technology)
Chung, Ildoo (Department of Polymer Science & Engineering, Pusan National University)
Kim, Gu Ni (Korea Institute of Footwear & Leather Technology)
Publication Information
Journal of Adhesion and Interface / v.11, no.1, 2010 , pp. 26-34 More about this Journal
Abstract
We synthesized polyurethane adhesive having thermal characteristic could be debonded by heat treatment and made a dismantlable polyurethane adhesive including thermally expansive bead. We used dynamic mechanical thermal analyzer (DMA) to confirm thermal characteristic and investigated bond strength, dismantlement property of dismantlable polyurethane adhesive by content of thermally expansive bead, heating trigger and treatment conditions. The dismantlable polyurethane adhesive could be expanded by hot-air or microwave treatment and the dismantlement of the specimens became easier as the weight fraction of the thermally expansive bead increased. At the dismantlable polyurethane adhesive, the content of thermally expansive bead 40% was suitable for both bond strength and dismantlement, in case of using hot-air treatment as trigger for dismantlement, bonded joints were separated easily at $160^{\circ}C$ for 30 min and in case of using microwave as trigger, bonded joints were separated easily by irradiating microwave for 4 min.
Keywords
dismantlement; thermal expansive bead; heating trigger; polyurethane;
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  • Reference
1 H. Kishi, Y. Inada, J. Imade, and K. Uesawa, Journal of the Adhesion Society of Japan, 42, 356 (2006).   DOI
2 H. Sakurai, Bulletin of Shizuoka Industrial Technology Research Center, 43, 6, (1998).
3 M. Hanafi, Y. Nishiyama, and C. Sato, Proceedings of EURADH, p.133, (2002).
4 K. Hori, Development of Bonding and Debonding Technology Meeting Recycle Requirement of JSME Colloquium, 86, 9 (2001).
5 H. Kishi, J. Imade, and Y. Inada, Japan Society of Adhesion, p.53 (2007).
6 H. Kishi, Y. Inada, and J. Imade, Adhesion, p.47 (2006).
7 S. Shimotsuma, Journal of the Adhesion Society of Japan, 42, 445 (2006).   DOI
8 C. Sato, Journal of the Adhesion Society of Japan, 40, 595 (2004).
9 H. Ishikawa, K. Seto, and S. Shimotuma, Adhesion, p.169 (2004).
10 Y. Nishiyama, C. Sato, and N. Uto, Journal of the Adhesion Society of Japan, 40, 298 (2004).   DOI
11 H. Tomita, Journal of the Adhesion Society of Japan, 39, 271 (2003).   DOI
12 C. Sato, Journal of the Adhesion Society of Japan, 39, 295 (2003).   DOI
13 H. Ishikawa, Proceedings of JSME Colloquium, 86, 5 (2001).
14 Y. Nishiyama, N. Uto, and C. Sato, Adhesion, p.159 (2003).
15 T. Fukushima, Materials transactions, 46, 2567 (2005).   DOI   ScienceOn
16 H. Ishikawa, K. Seto, and S. Shimotuma, International Journal of Adhesion and Adhesives, 25, 193 (2005).   DOI   ScienceOn
17 Y. Nishiyama, N. Uto, and C. Sato, International Journal of Adhesion and Adhesives, 23, 377 (2003).   DOI   ScienceOn
18 H. Kishi and C. Sato, Journal of the Society of Automotive Engineers of Japan, 61, 43 (2007).