1 |
J. Guo, J. Liang, X. Zhang, P. D. Judge, X. Wang, and T. C. Green, "Reliability Analysis of MMCs Considering Submodule Designs with Individual or Series-Operated IGBTs," IEEE Trans. Power Delivery, vol.32, no.2, pp.666-677, 2017. DOI: 10.1109/TPWRD.2016.2572061
DOI
|
2 |
J. Xu, P. Zhao, and C. Zhao, "Reliability Analysis and Redundancy Configuration of MMC With Hybrid Submodule Topologies," IEEE Trans. Power Electronics, vol.31, no.4, pp.2720-2729, 2016. DOI: 10.1109/TPEL.2015.2444877
DOI
|
3 |
Y. Dong, H. Yang, W. Li, and X. He, "Neutral-Point-Shift-Based Active Thermal Control for a Modular Multilevel Converter Under a Single-Phase-to-Ground Fault," IEEE Trans. Ind. Elec., vol.66, no.3, pp.2474-2484, 2019. DOI: 10.1109/TIE.2018.2833019
DOI
|
4 |
W. Denson, "The history of reliability prediction," IEEE Trans. reliability, vol.47, no.3, pp.321-328, 1998. DOI: 10.1109/24.740547
|
5 |
Y. D. Wang and B. F. Song, "Overview of system reliability prediction method," Aircraft Design, vol.28, no.1, pp.37-42, 2008.
DOI
|
6 |
J. Jones and J. Hayes, "A comparison of electronic-reliability prediction models," IEEE Trans. Reliability, vol.48, no.2, pp.127-134, 1999. DOI: 10.1109/24.784270
DOI
|
7 |
M. J. Cushin, D. E. Mortin , T. J. Stadterman, and A. Malhotra, "Comparison of Electronics-Reliability Assessment Approaches," IEEE Trans. Reliability, vol.42, no.4, pp.542-546, 1993. DOI: 10.1109/24.273574
DOI
|
8 |
Reliability prediction of electric equipment, Department of Defense, Washington DC, Tech. Rep. MIL-HDBK-217F, 1991.
|
9 |
H. Lambilly and H. O. Keser, "Failure Analysis of Power Modules: A Look at the Packaging and Reliability of Large IGBT's," IEEE Trans. Components, Hybrids, and Manufacturing Tech., vol.16, pp.412-417, 1993. DOI: 10.1109/IEMT.1992.639922
DOI
|