Browse > Article
http://dx.doi.org/10.7471/ikeee.2017.21.3.272

Effects of PCB Patterns on EMI Measurement in TEM Cell and Proposal of PCB Design Guidelines  

Choi, Minkyoung (School of Electronic Engineering, Soongsil University)
Shin, Youngsan (School of Electronic Engineering, Soongsil University)
Lee, Seongsoo (School of Electronic Engineering, Soongsil University)
Publication Information
Journal of IKEEE / v.21, no.3, 2017 , pp. 272-275 More about this Journal
Abstract
Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.
Keywords
TEM Cell; PCB; EMI; IEC61967-2; Design Guideline;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
연도 인용수 순위
1 O. Kwon, J. Son, T. Kim, and J. Song, "Implementation of a High Efficiency SCALDO Regulator Using MOSFET," j.inst.Korean.electr.electron.eng, vol. 19, no. 3, pp. 304-310, 2015. DOI : 10.7471/ikeee.2015.19.3.304
2 T. Park, J. Wee, and S. Lee, "A Low EMI Spread Spectrum Clock Generator Using TIE-Limited Frequency Modulation Technique," j.inst.Korean.electr.electron.eng, vol. 17, no. 4, pp. 537-543, 2013. DOI : 10.7471/ikeee.2013.17.4.537
3 Y. Moon, W. Lim, T. Kim, and J. Kang, "A Spread Spectrum Clock Generator for SATA II with Rounded Hershey-Kiss Modulation Profile," j.inst.Korean.electr.electron.eng, vol. 15, no. 2, pp. 129-133, 2011.
4 M. Choi, C. Kim, and S. Lee, "Analysis of the Signal Transmission Characteristics with Curvature of PCB Pads," j.inst.Korean.electr.electron.eng, vol. 20, no. 4, pp. 416-419, 2016.
5 S. Radu, "An Overview of Chip Level EMC Problems," http://www.scvemc.org/archive/032010Radu.pdf
6 IEC 61967-2:2005, "Integrated circuits-Measurement of electromagnetic emissions, 150 kHz to 1 GHz-Part 2: Measurement of radiated emissions, TEM cell and wideband TEM cell method," https://webstore.iec.ch/publication/6185
7 Y. Jung, "Wideband horn antenna including circular-polarizer and straight-type mode-converter for Ka-band," j.inst.Korean.electr.electron.eng, vol. 15, no. 4, pp. 299-304, 2011.
8 V. Kasturi, "The Influence of Printed Circuit Board Design on TEM Cell Measurements," Master Thesis, University of Missouri, 2007.
9 N. Boriraksantikul, "A TEM Cell Design to Study electromagnetic Radiation Exposure from Cellular Phones," Master Thesis, University of Missouri, 2008.