Browse > Article
http://dx.doi.org/10.7471/ikeee.2017.21.3.185

Modular platform techniques for multi-sensor/communication of wearable devices  

Park, Sung Hoon (Zaram Technology, Inc.)
Kim, Ju Eon (School of Electrical and Electronics Engineering, Chung-Ang University)
Yoon, Dong-Hyun (School of Electrical and Electronics Engineering, Chung-Ang University)
Baek, Kwang-Hyun (School of Electrical and Electronics Engineering, Chung-Ang University)
Publication Information
Journal of IKEEE / v.21, no.3, 2017 , pp. 185-194 More about this Journal
Abstract
In this paper, a modular platform for wearable devices is proposed which can be easily assembled by exchanging functions according to various field and environment conditions. The proposed modular platform consists of a 32-bit RISC CPU, a 32-bit symmetric multi-core processor, and a 16-bit DSP. It also includes a plug & play features which can quickly respond to various environments. The sensing and communication modules are connected in the form of a chain. This work is implemented in a standard 130 nm CMOS technology and the proposed modular wearable platforms are verified with temperature and humidity sensors.
Keywords
wearable devices; modular platform; SoC; multi core; sensor;
Citations & Related Records
연도 인용수 순위
  • Reference
1 T. Shimizu, et al . "A multimedia 32 b RISC microprocessor with 16 Mb DRAM", in Digest of Technical Papers. 42nd International Solid-State Circuits Conference (ISSCC) , Feb. 1996. DOI : 10.1109/ISSCC.1996.488577   DOI
2 E. MuraliKrishnan, E. Gangadharan, P. NirmalKumar. "FPGA Based Symmetric Multi-core Processors for Optimized Performance of H.264 Encoder", in Advances in Recent Technologies in Communication and Computing (ARTCom), 2010 International Conference on, Oct. 2010. DOI : 10.1109/ARTCom.2010.106
3 Po-Chih Tseng, Chi-Kuang Chen, Liang-Gee Chen. "CDSP: an application-specific digital signal processor for third generation wireless communications", IEEE Transactions on Consumer Electronics., vol 47, on. 3, pp.672- 677, Aug. 2001. DOI : 10.1109/30.964162   DOI