1 |
Kim, T. H.; Lee, K. H.; Kwon, Y. W. J. Colloid Interf. Sci. 2006, 304, 370.
DOI
ScienceOn
|
2 |
Fuji, M.; Takai, C.; Tarutani, Y.; Takei, T.; Takahashi, M. Adv. Powder Technol. 2007, 18, 81.
DOI
ScienceOn
|
3 |
Pei, A. H.; Shen, Z. W.; Yang, G. S. Mater. Lett. 2007, 61, 2757.
DOI
ScienceOn
|
4 |
Chopra, K. L.; Major, S.; Pandya, D. K. Electronics and Optics; 1983, pp 1-46.
|
5 |
Neerinck, D. G.; Vink, T. J. Thin Solid Films 1996, 278, 12.
DOI
|
6 |
Sizgek, E.; Bartlett, J. R.; Brungs, M. P. J. Sol-Gel Sic. Tech. 1988, 13 1011.
|
7 |
Roy, P.; Bertrand, G.; Coddet, C. Powder Technol. 2005, 157, 20.
DOI
|
8 |
Nagamine, S.; Sugioka, A.; Konishi, Y. Mater. Lett. 2007, 61, 444.
DOI
ScienceOn
|
9 |
Chung, Y. S.; Lim, J. S.; Park, S. B.; Okuyama, K. J. Chem. Eng. Jpn. 2004, 37, 1099.
DOI
ScienceOn
|
10 |
Fujiwara, M.; Shiokawa, K.; Tanaka, Y.; Nakahara, Y. Chem. Mater. 2004, 16, 5420.
DOI
ScienceOn
|
11 |
Im, S. H.; Jeong, U.; Xia, Y. Nat. Mater. 2005, 4, 671.
DOI
ScienceOn
|
12 |
Wang, D.; Song, C.; Lin, Y.; Hu, Z. Mater. Lett. 2006, 60, 77.
DOI
ScienceOn
|