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http://dx.doi.org/10.5012/bkcs.2004.25.2.167

Spectroscopic Studies on Electroless Deposition of Copper on Hydrogen-Terminated Si(111) Surface in NH4F Solution Containing Cu(II) Ions  

Lee, In-Churl (College of Science and Technology, Korea University)
Bae, Sang-Eun (College of Science and Technology, Korea University)
Song, Moon-Bong (College of Science and Technology, Korea University)
Lee, Jong-Soon (College of Science and Technology, Korea University)
Paek, Se-Hwan (College of Science and Technology, Korea University)
J.Lee, Chi-Woo (College of Science and Technology, Korea University)
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Abstract
The electroless deposition of copper on the hydrogen-terminated Si(111) surface was investigated by means of attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy, scanning tunneling microscopy (STM), and energy-dispersive spectroscopy (EDS). The hydrogen-terminated Si(111) surface prepared was stable under air atmosphere for a day or more. It was found from ATR-FTIR that two bands centered at 2000 and 2260 $cm^{-1}$ appeared after the H-Si(111) surface was immersed in 40% $NH_4F$ solution containing 10 mM $Cu^{2+}$. On the other hand, STM image included the copper islands with a height of 5 nm and a diameter of 10-20 nm. The EDS data displayed the presence of copper, silicon and oxygen species. The results were rationalized in terms of the redox reaction of surface Si atoms and $Cu^{2+}$ ions in solutions, which are changed into $Si(OH)_x(F)_y$ containing $SiF_6^{2-}$ ions and neutral copper islands.
Keywords
Silicon; Copper; Ammonium fluoride; ATR; STM;
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1 Ye, S.; Ishihara, T.; Uosaki, K. Appl. Phys. Lett. 1999, 75, 1562.   DOI
2 Morinaga, H.; Suyama, M.; Ohmi, T. J. Electrochem. Soc. 1994,141, 2834.   DOI
3 Chelma, M.; Homma, T.; Bertagna, V.; Erre, R.; Kubo, N.; Osaka,T. J. Electroanal. Chem. 2003, 559, 111.   DOI   ScienceOn
4 Lee, H.-Y.; Lee, C.-H.; Jeon, H.; Jung, D. Bull. Korean Chem. Soc.1997, 18, 737.
5 Graf, D.; Gruder, M.; Schulz, R. J. Vac. Sci. A 1989, 7, 808.   DOI
6 Li, G.; Jiao, J.; Seraphin, S.; Raghavan, S.; Jeon, J. S. J. Appl.Phys. 1999, 85, 1857.   DOI   ScienceOn
7 Ye, S.; Ishihara, T.; Uosaki, K. J. Electrochem. Soc. 2001, 148,C421.   DOI   ScienceOn
8 Neuwald, U.; Hessel, H. E.; Feltz, A.; Memmert, U.; Behm, R. J.Appl. Phys. Lett. 1991, 60, 1357.
9 Watanabe, S.; Nakamura, N.; Ito, T. Appl. Phys. Lett. 1991, 59,1458.   DOI
10 Hiraiwa, A.; Itoga, T. IEEE Trans. Semicond. Manufact. 1994, 7,60.   DOI   ScienceOn
11 Higashi, G. S.; Chabal, Y. J.; Trucks, G. W.; Raghavachari, K.Appl. Phys. Lett. 1990, 56, 656.   DOI
12 Homma, T.; Wade, C. P.; Chidsey, C. E. D. J. Phys. Chem. 1998,102, 7919.   ScienceOn
13 Trucks, G. W.; Raghavachari, K.; Higashi, G. S.; Chabal, Y. J.Phys. Rev. Lett. 1990, 65, 504.   DOI   ScienceOn
14 Song, M.-B.; Jang, J.-M.; Lee, C.-W. Bull. Korean Chem. Soc.2002, 23, 71.   DOI
15 Bensliman, F.; Fukuda, A.; Mizuta, N.; Matsumura, M. J.Electrochem. Soc. 2003, 150, G527.   DOI   ScienceOn
16 Watanabe, S. J. Chem. Phys. 2000, 113, 2423.   DOI   ScienceOn
17 Niwano, M.; Kaseyama, J.; Kurita, K.; Takahashi, I.; Miyamoto,N. J. Appl. Phys. 1994, 76, 2157.   DOI   ScienceOn