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Comer Detection in Gray Lavel Images for Wafer Die Position Recognition  

나재형 (숭실대학교 컴퓨터학과)
오해석 (경원대학교 소프트웨어대학)
Publication Information
Journal of KIISE:Software and Applications / v.31, no.6, 2004 , pp. 792-798 More about this Journal
Abstract
In this paper, we will introduce a new corner detector for the wafer die position recognition. The die position recognition procedure is necessary for WSCSP(Wafer Scale Chip Scale Packaging) technology, decide the accuracy of post-procedure. We present a hierarchical gray level corner detection method for the recognition of the die position from a wafer image. The new corner detector divides the corner region into many homocentric circles, and calculates the comer response and the angle of direction about each circle to get an accurate toner point. The new corner detector has a hierarchical structure so it can detect comer point more quickly than general gray level corner detector.
Keywords
wafer; die; pattern recognition; corner detection;
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Times Cited By KSCI : 2  (Citation Analysis)
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