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http://dx.doi.org/10.3745/KTCCS.2020.9.1.1

Development of Thermal Image Processing Module Using Common Image Processor  

Han, Joon Hwan (한화시스템 전자광학연구소)
Cha, Jeong Woo (한화시스템 전자광학연구소)
Kim, Bo Mee (한화시스템 전자광학연구소)
Lim, Jae Sung (아주대학교 소프트웨어학과)
Publication Information
KIPS Transactions on Computer and Communication Systems / v.9, no.1, 2020 , pp. 1-8 More about this Journal
Abstract
The thermal image device support image to detect infrared light from the object without light. It can use not only defence-related industry, but also civilian industry. This paper presents a new thermal image processing module using common image processor. The proposed module shows 10~20% performance improvement with normal mode and 50% performance improvement with sleep mode compared with the previously thermal image module based FPGA. and it guarantees high scalability according to modular system. In addition, the proposed module improves modulation and reuse, so it expect to have reduction of development period, low development cost. various application. In addition, it expect to have satisfaction of customer requirements, development design, development period, release date of product.
Keywords
Thermal Camera; Image Signal Processing; Common Image Processor; Thermal Image Signal Processing;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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