1 |
D. T. Martin, J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida, "A micromachined dual-backplate capacitive microphone for aeroacoustic measurements", J Microelectromech. Syst., Vol. 16, No. 6, pp. 1289-1302, 2007.
DOI
|
2 |
A. Ravi Sankar and S. Das, "A very-low cross-axis sensitivity piezoresistive accelerometer with an electroplated gold layer atop a thickness reduced proof mass", Sens. Actuators A, Vol. 189, pp. 125-133, 2013.
DOI
|
3 |
H. Nazemi, A. Joseph, J. Park, and A. Emadi, "Advanced Micro- and Nano-Gas Sensor Technology: A Review", Sensors, Vol. 19, No. 6, pp. 1285(1)-1285(23), 2019.
DOI
|
4 |
S. Saadon and O. Sidek, "A review of vibration-based MEMS piezoelectric energy harvesters", Energy Convers. Manag., Vol. 52, No. 1, pp. 500-504, 2011.
DOI
|
5 |
M. Pedersen, W. Olthuis, and P. Bergveld, "A silicon condenser microphone with polyimide diaphragm and backplate", Sens. Actuators A, Vol. 63, No. 2, pp. 97-104, 1997.
DOI
|
6 |
K. Oda, H. Takao, K. Terao, T. Suzuki, F. Shimokawa, I. Ishimaru, and F. Oohira, "Vertical comb-drive MEMS mirror with sensing function for phase-shift device", Sens. Actuators A, Vol. 181, pp. 61-69, 2012.
DOI
|
7 |
S. D. Senturia, Microsystem design, Kluwer Academic Publishers, New York, Boston, Dordrecht, London, Moscow, pp. 67-71, 2002.
|
8 |
Y. B. Gianchandani, O. Tabata, and H. P. Zappe, Comprehensive microsystems, Elsevier B.V., Amsterdam, pp. 183-216, 2008.
|
9 |
J. Laconte, D. Flandre, and J.-P. Raskin, Micromachined thin-film sensors for SOI-CMOS co-integration, Springer Science & Business Media, Dordrecht, pp. 17-45, 2006.
|
10 |
K. R. Williams, K. Gupta, and M. Wasilik, "Etch rates for micromachining processing-part II", J Microelectromech. Syst., Vol. 12, No. 6, pp. 761-778, 2003.
DOI
|
11 |
D. Bodas, S. J. Patil, V. Krishnamurthy, and S. J. J. o. t. I. I. o. S. Gangal, "PMMA as an etch mask for silicon micromachining a feasibility study", J Indian Inst. Sci., Vol. 81, No. 6, pp. 645-651, 2013.
|
12 |
J. T. Kung, A. N. Karanicolas, and H.-S. Lee, "A compact, inexpensive apparatus for one-sided etching in KOH and HF", Sens. Actuators A, Vol. 29, No. 3, pp. 209-215, 1991.
DOI
|
13 |
J. Brugger, G. Beljakovic, M. Despont, H. Biebuyck, N. F. de Rooij, and P. Vettiger, "High-yield wafer chuck for single-sided wet etching of MEMS structures", Proc. Int. Solid State Sens. Actuators Conf. (Transducers '97), pp. 711-713, Chicago, USA, 1997.
|
14 |
N. Kummer, J. Marek, M. Willmann, and G. Findler, "Device for one-sided etching of a semiconductor wafer", U.S. Patent No. 5,324,410. 28 Jun. 1994.
|
15 |
K. Sooriakumar, S. A. Switzer, K. E. Stegall, T. J. Dunlap, and C. M. Albrecht, "Substrate holder and method of use", U.S. Patent No. 5,578,167. 26 Nov. 1996.
|
16 |
G. S. J. J. o. C. Kell and E. Data, "Density, thermal expansivity, and compressibility of liquid water from 0. deg. to 150. Deg: Correlations and tables for atmospheric pressure and saturation reviewed and expressed on 1968 temperature scale", J. Chem. Eng. Data, Vol. 20, No. 1, pp. 97-105, 1975.
DOI
|
17 |
A. Dehe, M. Wurzer, M. Fuldner, and U. Krumbein, "A4. 3-The infineon silicon MEMS microphone", Proc. Sens. 2013, pp. 95-99, Germany, 2013.
|