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http://dx.doi.org/10.14346/JKOSOS.2012.27.6.026

Analysis of the Junction Temperature in the LED Chips using the Finite Element Method  

Han, Ji-Won (Department of Mechanical Engineering, Hoseo University)
Park, Joo-Hun (R&D Center of HANA Micron Inc.)
Publication Information
Journal of the Korean Society of Safety / v.27, no.6, 2012 , pp. 26-30 More about this Journal
Abstract
It is difficult to determine the junction temperature because LED lightings are manufactured using several chips with low power. This paper reports on the finite element method of the determination of junction temperature in the GaN-based LEDs. The calculated junction temperature of the LED chip using FEM was compared with the experimentally measured data. As the results of this study, the junction temperature of LED chips with via holes is lower than that of LED chips without via hole. Therefore, the research of via hole is necessary to decrease junction temperature of LED chips.
Keywords
thermal resistance; junction temperature; via hole; FEM; LED chip;
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