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http://dx.doi.org/10.6109/jkiice.2010.14.6.1460

Analysis of Breakdown voltage for Trench D-MOSFET using MicroTec  

Jung, Hak-Kee (군산대학교 전자공학과)
Han, Ji-Hyung (군산대학교 전자정보공학부)
Abstract
In the paper, the breakdown voltage of Trench D-MOSFET have been analyzed by using MircoTec. The technology for characteristic analysis of device for high integration is changing rapidly. Therefore to understand characteristics of high-integrated device by computer simulation and fabricate the device having such characteristics became one of very important subjects. A Trench MOSFET is the most preferred power device for high voltage power applications. The oxide thickness and doping concentration in Trench MOSFET determines breakdown voltage and extensively influences on high voltage. We have investigated the breakdown voltage characteristics according to variation of doping concentration from $10^{15}cm^{-3}$ to $10^{17}cm^{-3}$ in this study. We have also investigated the breakdown voltage characteristics according to variation of oxide thickness and junction depth.
Keywords
Trench D-MOSFET; Breakdown voltage; Oxide thickness; Doping concentration;
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1 F. Udrea, S. S. M. Chan, J. Thomson, T.Trajkovic, P. R. Waind, G. A. J. Amara-tunga, and D. E. Cress, "1.2 kV trench insulated gate bipolar transistors with ultralow on-resistance", IEEE Elec. Device Letters, Vol. 20, No. 8, p.428, 1999.   DOI   ScienceOn
2 강이구, 성만영, "레치업 특성의 개선과 고속 스위칭 특성을 위한 다중 게이트 구조의 새로운 LIGBT", 전기전자재료학회논문지, 제13권 제5호p.371, 2000.
3 R. Sodhi, "High-density ultra-low Rdson 30V n-channel trench FETs for DC/DC converter applications", Proceeding of ISPSD, p.307, 1999.
4 문승현, 강이구, 성만영, 김상식, "스마트 파워 IC를 위한 P+ Driver 구조의 횡형 트렌치 IGBT", 전기전자재료학회논문지, 제14권, 제7호, p.546, 2001.
5 양일석, 김종대, 장문규, "친황경 절전형 전력반도체기술", 전자통신동향분석 제 24권 제6호, pp.11-21, 2009.
6 V. Benda, J. Gowar, and D. A. Grant, "Power semiconduvtor devices", John Wiley @ Sons, Inc., 1999.