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Design of Housing Structure for the Suppression of Higher­Order Modes in the Microstrip Circuit Packaging  

전중창 (진주산업대학교 전자공학과)
Publication Information
Journal of the Korea Institute of Information and Communication Engineering / v.7, no.8, 2003 , pp. 1621-1628 More about this Journal
Abstract
Packaging structures to block the propagation of higher­order modes in the shielded microstrip lines are designed. Packaging for microwave circuits is necessary, basically, to isolate and protect circuits from outside environments both physically and electrically. The drawback of packaging is the possibility of higher­order mode propagation, similar to waveguide modes, as the operating frequency increases. One of Possible choices for the higher­order mode suppression is to insert diaphragms to the housing structure. The shielding effects of diaphragms are analyzed using an FEM code. Several parameters such as dispersion, mode conversion, and higher­order mode transmission and reflection are analyzed. The effect of higher­order mode suppression is eminent as the depth or width of a diaphragm is increased in the air region of the microstrip line. It is shown that inductive diaphragm structure can lower ${S_21}$ for the second­order mode incidence by 30㏈, comparing with the conventional capacitive diaphragm structure. Packaging structure analyzed in this paper can be applied usefully to the design of the microwave system in a package such as transmit/receive modules.
Keywords
마이크로파회로 패키징;마이크로스트립 회로;도파관 모드;고차 모드;분산 특성;유도성 격벽;
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