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http://dx.doi.org/10.5658/WOOD.2014.42.3.339

Estimation of Radio Frequency Electric Field Strength for Dielectric Heating of Phenol-Resorcinol-Formaldehyde Resin Used for Manufacturing Glulam  

Yang, Sang-Yun (Department of Forest Sciences, College of Agriculture and Life Sciences, Seoul National University)
Han, Yeonjung (Department of Forest Sciences, College of Agriculture and Life Sciences, Seoul National University)
Park, Yonggun (Department of Forest Sciences, College of Agriculture and Life Sciences, Seoul National University)
Eom, Chang-Deuk (Department of Forest Products, Korea Forest Research Institute)
Kim, Se-Jong (Department of Forest Products, Korea Forest Research Institute)
Kim, Kwang-Mo (Department of Forest Products, Korea Forest Research Institute)
Park, Moon-Jae (Department of Forest Products, Korea Forest Research Institute)
Yeo, Hwanmyeong (Department of Forest Sciences, College of Agriculture and Life Sciences, Seoul National University)
Publication Information
Journal of the Korean Wood Science and Technology / v.42, no.3, 2014 , pp. 339-345 More about this Journal
Abstract
For enhancing productivity of glulam, high frequency (HF) curing technique was researched in this study. Heat energy is generated by electromagnetic energy dissipation when HF wave is applied to a dielectric material. Because both lamina and adhesives have dielectric property, internal heat generation would be occurred when HF wave is applied to glulam. Most room temperature setting adhesives such as phenol-resorcinol-formaldehyde (PRF) resin, which is popularly used for manufacturing glulam, can be cured more quickly as temperature of adhesives increases. In this study, dielectric properties of larch wood and PRF adhesives were experimentally evaluated, and the mechanism of HF heating, which induced the fast curing of glue layer in glulam, was theoretically analyzed. Result of our experiments showed relative loss factor of PRF resin, which leads temperature increase, was higher than that of larch wood. Also, it showed density and specific heat of PRF, which are resistance factors of temperature increase, were higher than those of wood. It was expected that the heat generation in PRF resin by HF heating would occur greater than in larch wood, because the ratio of relative loss factor to density and specific heat of PRF resin was greater than that of larch wood. Through theoretical approach with the experimental results, the relative strengths of ISM band HF electric fields to achieve a target heating rate were estimated.
Keywords
Dielectric property; Dielectric heating; Power density; heating curing;
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Times Cited By KSCI : 3  (Citation Analysis)
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1 Pizzi, A. 2003. Handbook of Adhesive Technology 2nd ed. Marcel Dekker Inc,. New York.
2 Zhou, B., Avramidis, S. 1999. On the loss factor of wood during radio frequency heating. Wood Science & Technology 33(4): 299-310.   DOI
3 Pereira, C., Blanchard, C., Carvalho, L., Costa, C. 2004. High frequency heating of medium density fiberboard (MDF): theory and experiment. Chemical Engineering Science 59(4): 735-745.   DOI   ScienceOn
4 Shim, S.R., Yeo, H., Shim, K.B. 2005. Evaluation of Shear Bond Strength and Adhesive Bond Durability of Mixed Species Structural Glued Laminated Timber. Mokchae Konghak 33(1): 87-96.   과학기술학회마을
5 Kim, K.M., Shim, S.R., Shim, K.B., Park, J.S., Kim, W.S., Kim, B.N., Yeo, H. 2009. Development of Structural Glued Laminated Timber with Domestic Cedar. Mokchae Konghak 37(3): 184-191.   과학기술학회마을
6 Agilent Technologies, Inc. 2006. Application note : Basic of measuring the dielectric properties of materials. Agilent Technologies, Inc. USA. pp. 4-6.
7 Chae, S.H. 2007. Specific Heat Measurements of Several Polymer Materials. DanKook University Master's Thesis. Korea pp. 26-27
8 Kim, K.M., Shim, K.B., Park, J.S., Kim, W.S., Lim, J.A., Yeo, H. 2007. Development of Pitch Pine Glued Laminated Timber for Structural Use -Improvement of Bending Capacity of Pitch Pine Glulam by Using Domestic Larch Lamina-. Mokchae Konghak 35(6): 13-22.   과학기술학회마을
9 Lee, J.J., Kim, K.M., Han, J.S., Kim, J.K. 2003. Evaluation of the Bending Properties of Glulam with Different Cross-Section. Mokchae Konghak 31(5): 65-71.   과학기술학회마을
10 Skoog, D., Holler, J., Crouch, S. 2006. Principles of instrumental analysis 6th ed. Saunders College Publishing, New York. pp. 575-577.