1 |
Blomquist, R. F., A. W. Christiansen, R. H. Gillespie, and G. E. Myers. 1983. Adhesive bonding of wood and other structural materials. Volume III, Clark C. Heritage Memorial Series on Wood, Madison, Wis. 12-110
|
2 |
Mottet, A. L. 1967. The particle geometry factor in particleboard manufacturing. Proceedings of First Symposium on Particleboard, T. M. Maloney, Ed. Washington State University. Pullman, WA
|
3 |
Post, P. W. 1958. Effect of particle geometry and resin content on bending strength of oak board. Forest prod. J 8(10): 317-322
|
4 |
Price, Eddie W. and Lehmann, F. William. 1978. Flaking alternatives. Structural Flakeboard from Forest residues GTR WO-5. USDA, Forest Service
|
5 |
Schwarz, F. W., R. L. Anderson, and A. G. Kageler. 1968. Resin distribution and how variations affect board quality. Proceedings of Second Symposium on Particleboard, T. M. Maloney, Ed. Washington State University. Pullman, WA
|
6 |
Rayner, C. A. A. 1965. Synthetic organic adhesives, pp. 186-352. In: Houwink, R. and G. Salmon eds. Adhesion and adhesives, Vol. 1. Elsevier Publishing Company, New York
|
7 |
Papadopoulos, A. N., C. A. S. Hill, E. Traboulay, and J. R. B. Hague. 2002. Isocyanate Resins for Particleboard: PMDI vs EMDI. Holz als Rohund Werkstoff 60: 81-83
DOI
|
8 |
User's Guide: Statistics, Version 5, 1985. SAS Institute, Cary NC
|
9 |
Johns, William E. and Khan, Niazi A. 1980. Effect of pH and buffering capacity of wood on the gelation time of urea-formaldehyde resin. Wood and Fiber 12(4): 255-263
|
10 |
American Society for Testing and Materials. 1998. Standard method of evaluating the properties of wood-base fiber and particle panel materials. ASTM D 1037-78. part 2. American Society for Testing and Materials. Philadelphia, PA
|
11 |
Maloney T. M. 1993. Modern particleboard and dry-process fiberboard manufacturing. Miller Freeman Publication. San Francisco, CA
|
12 |
Narayanamurti, D. 1957. Die Bedeutung der Holzextrakstoffe. Holz Roh-Werkst. 15:370
DOI
|
13 |
American National Standard 'Mat-Formed Wood particleboard.' ANSI/208.1-1997. National Particleboard Association. Gaithersburg, MD
|
14 |
Deppe, H. J. 1977. Technical progress in using isocyanates as an adhesive in particleboard manufacture. Proceedings of Washington State University Symposium on particleboard, T. M. Maloney, Ed. Washington State University. Pullman, WA
|
15 |
Post, P. W. 1961. Relationship of flake size and resin content to mechanical and dimensional properties of flakeboard. Forest Prod. J 11(1):34-37
|
16 |
Shuler, Craig E. and Robert, Kelly A. 1976. Effect of flake geometry on mechanical properties of eastern spruce flake-type particleboard. Forest Prod. J 26(6): 24-28
|
17 |
Adams, A. D. 1980. EMDI binder for particleboard and waferboard. Proceedings of the international particleboard symposium. Washington State University, Pullman, WA pp. 195-205
|
18 |
Ahmad, M. and F. A. Kamke. 2004. Wettability and pH value related to gluability of Calcutta bamboo. ICCFOPI International Conference on Environmentally-Compatible Forest Products. Oporto, Portugal, 22-24
|