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http://dx.doi.org/10.12673/jkoni.2013.17.6.658

Ring Hybrid Coupler using Microstrip Line with Via Transition  

Kim, Young (Department of Electronic Engineering, Kumoh National Institute of Technology)
Sim, Seok-Hyun (Department of Electronic Engineering, Kumoh National Institute of Technology)
Yoon, Young-Chul (Department of Electronics & Information Communication Eng., Kwandong University)
Publication Information
Journal of Advanced Navigation Technology / v.17, no.6, 2013 , pp. 658-663 More about this Journal
Abstract
In this paper, a microstrip line implementation using via transition and its application of multilayer compact ring hybrid coupler are presented. This transition is the sandwich structure with via hole to connect two microstrip lines in different layer. For designing a compact RF/Microwave passive circuit, the microstrip line using via-hole transition is proposed to reduce a size of microwave circuit with long transmission line. For the validation of the microstrip line with via-hole transition, the multilayer ring hybrid coupler is implemented at center frequency of 2 GHz. The measured performances are in good agreement with simulation results and about 50% size reduction compare to conventional ring hybrid coupler.
Keywords
Microstrip transition; multilayer circuit; passive circuit; size reduction; via-holes;
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