Browse > Article
http://dx.doi.org/10.9713/kcer.2020.58.3.474

Effects of Ingredients of Wet Etchant on Glass Slimming Process  

Shin, Young Sik (Division of Chemical Engineering and Bioengineering, Kangwon National University)
Lee, Won Gyu (Division of Chemical Engineering and Bioengineering, Kangwon National University)
Publication Information
Korean Chemical Engineering Research / v.58, no.3, 2020 , pp. 474-479 More about this Journal
Abstract
The etching solution for slimming of glass substrates was manufactured and HF was used as the main ingredient of wet etching solutions. Various types of strong acids such as HCl, HNO3, H2SO4, amino acids and carboxylic acids such as citric acid, and etched solutions, respectively, were used to measure the etching rates and changes in surface shape of the glass. Regardless of the type of strong acids, the etching rate of the glass increased linearly as the added amount increased, and the sludge removal effect of the glass surface was also shown. The etching solution containing HCl showed more efficient results than other strong acids in the etching rate and the effect of removing sludge. The addition of carboxylic acid did not significantly affect the variation of etching rate, but had the effect of removing sludge. However, if amino acids were added, changes in etching rate and sludge removal were not significant.
Keywords
Glass slimming; Wet etching; Etchant; Sludge; Etch rate;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Tsai, T. and Wu, Y., "Wet Etching Mechanisms of ITO Films in Oxalic Acid," Microelectron. Eng., 83, 536-541(2006).   DOI
2 Takechi, K., Eguchi, T., Kanoh, H., Ito, T. and Otsuki, S., "High-Rate Glass Etching Process for Transferring Polycrystalline Silicon Thin-Film Transistors to Flexible Substrates," IEEE Trans. Semicon. Manufacturing, 18, 384-389(2005).   DOI
3 Judge, J. S., "A Study of the Dissolution of $SiO_2$ in Acidic Fluoride Solutions," J. Electrochem. Soc., 118,1772-1775(1971).   DOI
4 Iliescu, C., Chen, B. and Miao, J., "On the Wet Etching of Pyrex Glass," Sens. Actuators A, 143, 154-161(2008).   DOI
5 Spierings, G. A. C. M., "Wet Chemical Etching of Silicate Glasses in Hydrofluoric Acid Based Solutions," J. Mat. Sci., 28, 6261-6273(1993).   DOI
6 Sujana, M., Thakur, R. and Rao, S., "Removal of Fluoride from Aqueous Solution by using Alum sludge," J. Colloid Interface Sci., 206, 94-101(1998).   DOI
7 Spierings, G. and Dijk, J., "The Dissolution of $Na_2O$-MgO-CaO-$SiO_2$ Glass in Aqueous HF Solutions," J. Mat. Sci., 22, 1869-1874 (1987).   DOI
8 Byun, J. Y., "A Study on Etching of $EAGLE^{2000TM}$ LCD Glass by HF-HCl Mixed Solutions," J. Microelectronics & Packing Society, 15, 41-46(2008).
9 Lee, C. T., "Non-HF Etching Solution for Slimming of Flat Panel Display Glass," Appl. Chem. Eng., 27, 101-109(2016).   DOI
10 Iliescu, C., Jing, J., Tay, F. E., Miao, J. and Sun, T., "Characterization of Masking Layers for Deep Wet Etching of Glass in an Improved HF/HCl Solution," Surf. Coat. Tech., 198, 314-318 (2005).   DOI
11 Steinert, M., Acker, J., Oswald, S. and Wetzig, K., "Study on the Mechanism of Silicon Etching in $HNO_3$-rich HF/$HNO_3$ Mixtures," J. Phys. Chem. C, 111, 2133-2140(2007).   DOI
12 Steinert, M., Acker, J. and Wetzig, K., "New Aspects on the Reduction of Nitric Acid during Wet Chemical Etching of Silicon in Concentrated HF/$HNO_3$ Mixtures," J. Phys. Chem. C, 112, 14139-14144(2008).   DOI
13 Yamamura, K. and Mitani, T., "Etching Characteristics of Local Wet Etching of Silicon in HF/$HNO_3$ Mixtures," Surf. Interface Anal., 40, 1011-1013(2008).   DOI