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http://dx.doi.org/10.14775/ksmpe.2018.17.6.091

Effects of Temperature on Removal Rate in Cu CMP  

Park, In-Ho (School of Mechanical Engineering, PUSAN UNIV.)
Lee, Da-Sol (School of Mechanical Engineering, PUSAN UNIV.)
Jeong, Seon-ho (School of Mechanical Engineering, PUSAN UNIV.)
Jeong, Hae-do (School of Mechanical Engineering, PUSAN UNIV.)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.17, no.6, 2018 , pp. 91-97 More about this Journal
Abstract
Chemical mechanical polishing(CMP) realizes a surface planarity through combined mechanical and chemical means. In CMP process, Preston equation is known as one of the most general approximation of the removal rate. Effects of pressure and relative speed on the mechanical property of Cu CMP has been investigated. On the other hand, The amount of abrasion also increased with changes in pressure and speed, resulting in a proportional increase of temperature during CMP. Especially this temperature is an important factor to change chemical reaction in a Cu CMP. However, when the slurry temperature became higher than $70^{\circ}C$, the removal rate went lower due to abrasives aggregation and scratching occurred on the Cu film. Therefore, it was found that the slurry temperature should not exceed $70^{\circ}C$ during Cu CMP. Finally, authors could increase the pressure, speed and slurry temperature up to a ceratin level to improve the removal rate without surface defects.
Keywords
CMP; Slurry Temperature; Size of Particles;
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  • Reference
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