1 |
Antonini, G., "Applying Machining Center Technology to Grinding", Modern Machine Shop, Vol. 66, No. 7, pp. 70, 1993.
|
2 |
Nakagawa, H., Hirogaki, T., Iwasaki, Y., Hayashi, T., Kita, Y. and Kakino, Y., "Study on Oscillation Grinding by Numerical Control with a Machining Center", Journal of the Japan Society of Precision Engineering, Vol. 68, No. 7, pp. 923-927, 2002.
DOI
|
3 |
Rausch, S., Odendahl, S., Kersting, P., Biermann, D. and Zabel, A., "Simulation-Based Prediction of Process Forces for Grinding Free-Formed Surfaces on Machining Centers", Procedia CIRP, Vol. 4, pp. 161-165, 2012.
DOI
ScienceOn
|
4 |
Choi, H., Kim, C. S., Park, W. K., and Lee, C. S., "The Effects on a Side-cut Grinding depend on the Change of the Quill Rigidity", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 12, No. 5, pp. 36-41, 2013.
|
5 |
Lee, C. S., Kim, C. S., Park, W. K., Lee, J. C. and Choi, H., "A Study on the Side-Cut Grinding using the CBN Wheels", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 11, No. 3, pp. 98-103, 2012.
|
6 |
Rausch, S. and Biermann, D., "Grinding of Hard-Material-Coated Forming Tools on Machining Centers", Procedia CIRP, Vol. 1, pp. 388-392, 2012.
DOI
ScienceOn
|