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http://dx.doi.org/10.14775/ksmpe.2015.14.1.092

Carrier Design by Temperature Distribution Analysis in Chamber of ITO Deposition Inline Sputter  

Lee, Sang-Jae (Department of Electronic Engineering, Kumoh National Institute of Technology)
Choi, Ju-Ran (Department of intelligent Mechanical Engineering, Graduated School of Kumoh National Institute of Technology)
Choi, Seong-Dae (Department of intelligent Mechanical Engineering, Kumoh National Institute of Technology)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.14, no.1, 2015 , pp. 92-97 More about this Journal
Abstract
The design of the glass-carrier was studied using simulations of the temperature distribution of an ITO deposition inline-sputter process. The temperature distribution was simulated in Heating Chamber 7, and in the ITO Deposition Chambers 8 and 9. The temperature distribution of the glass sheets was low in both the lower and upper lines. Moreover, it was observed that the temperature in Chamber 8 significantly affected the temperature in Chamber 9, and that the latter was hotter. The rear of the chambers were subjected to more heating than the fronts, so the temperature range at the back was wider. Redesigning the shape of the carrier made it possible to load more glass sheets on the glass carrier, and to make deposits on the ITO glass at higher temperature, over a wider area.
Keywords
Temperature Distribution Analysis; ITO Deposition; Sputtering; Chamber; Carrier; Phone Glass;
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  • Reference
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