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http://dx.doi.org/10.5139/JKSAS.2018.46.10.876

PBGA Packaging Reliability under Satellite Random Vibration  

Lee, Seok-min (Department of Aerospace Engineering, Inha University)
Hwang, Do-soon (Korea Aerospace Research Instituite)
Kim, Sun Won (Korea Aerospace Research Instituite)
Kim, Yeong Kook (Department of Mechatronics Engineering, Inha University)
Publication Information
Journal of the Korean Society for Aeronautical & Space Sciences / v.46, no.10, 2018 , pp. 876-882 More about this Journal
Abstract
The purpose of this research is to verify the feasibility of Plastic Ball Grid Array (PBGA), one of the most popular chip packaging types for commercial electronics, under strong random vibration occurred in satellite during launch. Experiment were performed by preparing daisy chained PCB specimen, where large size PBGA were surface mounted, and the PCB was fixed to an aluminum frame which is commonly used to install the electronics parts to satellite. Then the entire sample was fixed to vibration tester. The random vibration power spectrum density employed in the tests were composed of two steps, the acceptance level of 22.7 Grms, and qualification level of 32.1 Grms with given period of time. The test results showed no solder cracks, which provided the strong structural integrity and feasibility evidences of the PBGA packaging to aerospace electronics. Numerical analyses were also performed to calculate the solder stresses and analyze their development mechanism.
Keywords
Satellite electronics device; Random vibration; PBGA; Structural reliability;
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