1 |
H. Watanabe, H. Wada, K. Seki, M. Itou, and N. Kijima, J. Electrochem. Soc. 155, F31 (2008).
DOI
|
2 |
N. Takahashi, Y. Suzuki, and M. Kakihana, J. Ceram. Soc. Jpn. 117, 313 (2009).
DOI
ScienceOn
|
3 |
Y. Suzuki and M. Kakihana, J. Ceram. Soc. Jpn. 117, 330 (2009).
DOI
ScienceOn
|
4 |
M. Kakihana, J. Ceram. Soc. Jpn. 117, 857 (2009).
DOI
ScienceOn
|
5 |
T. Nakanishi and S. Tanabe, J. Light Vis. Environ. 32, 93 (2008).
DOI
ScienceOn
|
6 |
M. Mikami, H. Watanabe, K. Uheda, S. Shimooka, Y. Shimomura, T. Kurushima, and N. Kijima, IOP Conf. Ser.: Mater. Sci. Eng. 1, 012002 (2009).
|
7 |
J. Yum, S. Seo, S. Lee, and Y. Sung, J. Electrochem. Soc. 150, H47 (2003).
DOI
ScienceOn
|
8 |
S.H.M. Poort, W. Janssen, and G. Blasse, J. Alloys Compd. 260, 93 (1997).
DOI
ScienceOn
|
9 |
J.K. Park, M.A. Lim, C.H. Kim, H.D. Park, and J.T. Park, Appl. Phys. Lett. 82, 683 (2003).
DOI
ScienceOn
|
10 |
Y. Shimomura, T. Honma, M. Shigeiwa, T. Akai, K. Okamoto, and N. Kijima, J. Electrochem. Soc. 154, J35 (2007).
DOI
ScienceOn
|
11 |
M. Mikami, S. Shimooka, K. Uheda, H. Imura, and N. Kijima, Key Eng. Mater. 403, 11 (2009).
DOI
|
12 |
Y.Q. Li, A.C.A. Delsing, G. deWith, and T. Hintzen, Chem. Mater. 17, 3242 (2005).
DOI
ScienceOn
|
13 |
V. Bachmann, T. Justela, A. Meijerink, C. Ronda, and P.J. Schmidt, J. Lumin. 121, 441 (2006).
DOI
ScienceOn
|
14 |
Y.Q. Li, J.E.J. van Steen, J.W.H. van Krevel, G. Botty, A.C.A. Delsing, F.J. DiSalvo, G. deWith, and H.T. Hintzen, J. Alloys Compd. 417, 273 (2006).
DOI
ScienceOn
|
15 |
X. Piao, T. Horikawa, H. Hanzawa, and K. Machida, Appl. Phys. Lett. 88, 161908 (2006).
DOI
ScienceOn
|
16 |
K. Uheda, N. Hirosaki,Y.Yamamoto, A. Naito, T. Nakajima, and H. Yamamoto, Electrochem. Solid-State Lett. 9, H22 (2006).
DOI
ScienceOn
|
17 |
G. Blasse and A. Bril, Appl. Phys. Lett. 11, 53 (1967).
DOI
|