1 |
A. Fiala, L. Pitchford and J Boeuff, Phys. Rev. E 49, 5607 (1994).
|
2 |
A. Murphy and C Arundell, Plasma Chem. Plasma Process. 14, 451 (1994).
DOI
|
3 |
J. Hopwood, Plasma Sources Science and Technology 1, 109 (1992).
DOI
|
4 |
K. Nakamura, Y. Kuwashita, and H. Sugai, Japanese Journal of Applied Physics 34, L1686 (1995).
DOI
|
5 |
K. Ikeda, T. Okumura, and V. Kolobov, Journal of the Vacuum Society of Japan 50, 424 (2007).
DOI
|
6 |
M. Lieberman, J. Booth, P. Chabert, R. Rax and Turner, Plasma Sources Sci. Technol. 11, 283 (2002).
DOI
|
7 |
V. Guerra, P. Sa and J. Loureiro, Eur. Phys. J. Appl. Phys. 28, 125 (2004).
DOI
|
8 |
M. Lieberman and A. Litchenberg, Principles of plasma discharges and material processing, John Wiley&Sons (2005).
|
9 |
H. Kim, F Iza, S Yang, M Radmilovic-Radjenovic, and J Lee, J. Phys. D 38, R283 (2005).
DOI
|
10 |
H. Schmidt, L. Sansonnens,A. Howling, C. Hollenstein, M. Elyaakoubi and J. Schmitt, J. Appl. Phys. 95, 4559 (2004).
DOI
|
11 |
Z. Chen, S. Rauf and K. Collins, J. Appl. Phys. 108, 073301 (2010).
DOI
|
12 |
I. Lee, D. Graves, and M. Lieberman, Plasma Sources Sci. and Technol. 17, 015018 (2008).
DOI
|